LOGO UGPCB
The Full Name and Description of LGA Package
The full name of LGA package is Land Grid Array package, which literally translates to grid array packaging, which corresponds to the previous packaging technology of Intel processors, Socket 478, which is also called Socket T. Said it is a “leapfrog technological revolution”, mainly because it replaces the previous pin-shaped pins with metal contact packaging. The LGA775, as the name suggests, has 775 contacts.
Installation Method of LGA775 Processor
Because the pins become contacts, the installation method of the processor with the LGA775 interface is also different from that of the current product. It cannot use the pins to fix the contact, but needs a mounting bracket to fix it, so that the CPU can be pressed correctly. On the elastic tentacles exposed by the Socket, Le principe est le même que le package BGA, sauf que le BGA est soudé à mort, Et le LGA peut être déverrouillé à tout moment pour remplacer la puce. Le “B (Balle)” en perle bga-tin, La puce et le circuit de la carte mère sont contactés par la perle en étain, Ceci est le package BGA.
À haute densité, Multicolatrie, et les exigences de miniaturisation
De plus en plus à haute densité, Les exigences multifonction et miniaturisation ont apporté de nouveaux défis à l'emballage et aux substrats, Et de nombreuses nouvelles technologies d'emballage ont émergé, y compris les technologies d'emballage enterrées. La technologie d'emballage intégrée consiste à intégrer des composants passifs tels que des résistances, condensateurs, inducteurs, et même des composants actifs tels que ICS dans la carte de circuit imprimé. Cette approche peut raccourcir la longueur de ligne entre les composants, Améliorer les caractéristiques électriques, et améliorer la zone d'emballage de la carte de circuit imprimé efficace réduit un grand nombre de joints de soudure sur la surface de la carte de circuit imprimé, améliorant ainsi la fiabilité de l'emballage et réduisant le coût. C'est une technologie d'emballage à haute densité très idéale.
Transfert de technologie intégré du PCB vers le substrat
La technologie intégrée précoce a été principalement appliquée aux PCB, Et maintenant, il est également appliqué aux substrats de package. L'intégration de composants passifs tels que les résistances et les condensateurs dans les PCB est déjà une technologie très mature, Et UGPCB maîtrise ce type de technologie depuis longtemps. Le transfert de technologie enterrée du PCB vers le substrat est plus difficile à réaliser. Parce que le substrat a une précision plus élevée et une épaisseur de dégradation plus mince, it requires stronger manufacturing and processing capabilities and higher precision. Cependant, because the technical principle is the same, the passive devices embedded in the substrate also quickly achieved mass production.
Types of Embedded Passive Components
UGPCB has two main types of passive components such as resistors and capacitors embedded in the substrate. One is planar burying, also called thin-film burying, which means that only a few microns of resistors and capacitors are embedded in the board and transferred through graphics., Acid etching and other series of processes to make corresponding resistance or capacitance patterns. The other method is discrete embedding, which is to put the resistors and capacitors of ultra-thin package specifications such as 01005, 0201, 0402 directly into the substrate through the SMT process and the hole-filling interconnection process. Buried packaging does not limit the number of components embedded. It mainly depends on the packaging area. If the area is sufficient, more can be buried. Although the packaging cost of this approach will become higher, the cost of the entire product may not become higher, because the subsequent component purchase and SMT chip cost can be saved, and the performance will also be improved.
Embedded IC Technology
In addition to embedding passive components such as resistors, condensateurs, et inducteurs, UGPCB circuits are also actively developing embedded IC technology, c'est, directly embedding the chip die into the substrate for board-level packaging, which is more complicated than embedding passive components . After long-term technology accumulation and innovation, UGPCB circuit company has now produced IC embedded substrate samples. The next step is to jointly develop with customers and define the final product according to their needs. The UGPCB circuit is now mainly looking for customers who have ideas in this area to jointly develop and make productization and engineering. We already have the technology, but we need to apply this technology to products on a large scale in the follow-up and improve the production yield and reliability. We also need to look for customers who are willing to do this, and find some real products to do it.
Market Prospects for Built-In Component Substrates
The demand for high-density, miniaturized packaging is increasing, et le marché des substrats de composants intégrés devrait continuer à se développer. L'émergence d'une technologie intégrée contient la possibilité de changements majeurs dans la structure industrielle et la structure de l'industrie, des usines matérielles, Foundries IC, COMPOSITIONS DE CONCEPTION IC TO CIRCUITS CIRCUITS / FABRICANTS SUBSTRAT, fabricants d'emballages, fabricants de systèmes, c'est, en amont et en aval de la chaîne industrielle, la collaboration est indispensable.
Impact sur les fournisseurs d'appareils d'origine
Le développement de la technologie intégrée a un grand impact sur les fournisseurs d'appareils d'origine, Et ils doivent changer en ce moment. Par exemple, Ses appareils doivent remplir les conditions intégrées. L'émergence de nouvelles technologies brisera certainement le modèle inhérent. It is very important for enterprises to keep abreast of market changes and make timely transformation.
Innovative Packaging Solutions
As SoC chip integration is close to the physical limit, advanced packaging technologies such as wafer-level packaging (Fournisseur de services de chiffrement), system-in-package (Siroter), and device embedding provide a feasible way for further system integration. À l'heure actuelle, leading complete machine equipment manufacturers not only consider device functions when designing products, but also start to consider packaging design, module design, embedded PCB design, etc., and are actively looking for innovative component and module packaging solutions to improve the system Reliability, reduce product size, realize product optimization and innovation.
