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Network equipment circuit board design - et

Conception de PCB haute puissance/

Network equipment circuit board design

Nom: Network equipment circuit board design

Couches concevables: 1-32 couches

Largeur de ligne minimale et espacement des lignes: 3mil

Ouverture laser minimale: 4mil

Ouverture mécanique minimale: 8mil

Épaisseur de la feuille de cuivre: 18-175cm (standard: 18cm35cm70cm)

Résistance au pelage: 1.25N/mm

Diamètre minimum du trou de perforation: un seul côté: 0.9mm/35 mil

Diamètre minimum du trou: 0.25mm/10 mil

Tolérance d'ouverture: ≤φ0,8 mm ± 0,05 mm

Hole tolerance: ±0.05mm

  • Détails du produit

Various Names of Circuit Boards

The names of circuit boards are: circuit imprimé en céramique, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit imprimé, Carte PCB, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, Thin circuit boards, imprimé (copper etching technology) circuit boards, etc..

Importance of Circuit Boards

The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

Types of Circuit Boards

Printed Circuit Boards (PCB)

Circuit boards can be called printed circuit boards.

FPC Circuit Boards

FPC circuit boards (also known as flexible circuit boards) are a kind of high reliability made of polyimide or polyester film as the base material. They are an excellent flexible printed circuit board with the characteristics of high wiring density, poids léger, thin thickness, and good bendability.

Soft-Rigid Board

The birth and development of the flexible and rigid combination board—FPC and PCB, gave birth to the combination of flexible and rigid board this new product. Donc, the soft-rigid board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards according to relevant process requirements through lamination and other processes.

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