LOGO UGPCB
1. The chip adopts high-power back aluminum plating technology, with unique vertical heat dissipation for SMD LEDs, a bottom heat sink, and direct thermal conduction from the chip to the heat sink, offering a larger heat dissipation area compared to 3014 and faster, more direct cooling.
2. It uses a full-surface lighting scheme with a rectangular light-emitting surface, achieving higher illumination efficiency and covering an area of 9.18mm², which is twice that of a 3528 LED and 2.5 times that of a 3014 LED.
3. High brightness; each LED can reach up to 22Lm, ce qui est 2.8 times brighter than a 3528 LED and 1.8 times brighter than a 3014 LED.
4. The thickness of the LED is only half that of a 3528 LED, with a 120-degree light emission angle. In finished applications, this results in a more uniform light spot and broader illumination coverage.
5. Le 2835 is an upgraded new type of light source with wide applications. It overcomes the narrow side emission angle limitation of the 3014 and effectively addresses the point light source phenomenon in 3528 lighting applications.
6. To improve light transmittance by 10%, an 85-95% transparent cover can be used, which is particularly noticeable in LED fluorescent lamps.
7. Special specifications can effectively replace the 5050 LED.
UGPCB is responsible for PCB assembly and SMD 2835 panels. We use high-power back aluminum plating technology and a comprehensive lighting scheme. Our product performance is excellent. You are welcome to learn more about us.
