et,PCB, Personnalisation PCBA et PECVD, producteur de prototypage et de fabrication

Télécharger | À propos | Contact | Plan du site

Ro4835 + IT180 High Frequency Hybrid PCB - et

PCB hybride/

Ro4835 + IT180 High Frequency Hybrid PCB

Nom du produit: Ro4835 + IT180 High Frequency Hybrid Plate

Plaque: Rogers Ro4835+IT180

Calques: 6 couches

Épaisseur du panneau: 1.5MM

Épaisseur du cuivre: finished copper thickness 1OZ

Impedance: 50 ohm

Media thickness: 0.127mm

Constante diélectrique : 3.48

Thermal conductivity: 0.69avec m.k

Flame retardant grade: 94V-0

Volume resistivity: 1.2*1010

  • Détails du produit

Overview

Rogers RO4835 substrate is a hydrocarbon ceramic laminate, an oxidation resistant high frequency material for applications requiring greater stability at elevated temperatures. It is more resistant to oxidation than other hydrocarbon-based materials. RO4835 laminates are designed to provide excellent high frequency performance and low cost circuit fabrication. En plus, the electrical and mechanical properties of the RO4835 material are nearly identical to the RO4350B laminate that customers have used successfully for many years.

Oxidation Effects on Thermoset Laminates

Oxidation affects all thermoset laminates over time and temperature. In the long run, oxidation causes a small increase in the dielectric constant and dissipation factor of the circuit substrate.

Features and Benefits of RO4835 Substrate

Improved Oxidation Resistance

  1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance-sensitive high-volume applications.

Excellentes performances électriques

  1. Low losses exhibit excellent electrical performance, allowing applications with higher operating frequencies, especially automotive applications.

Controlled Impedance Transmission Lines

  1. Tight permittivity tolerances lead to controlled impedance transmission lines.

Lead-Free Process Compatibility

  1. Lead-free process compatibility resulting in no blistering or delamination.

Reliable Plated Through Holes

  1. Low Z-axis spread results in reliable plated through holes.

Stable In-Plane Expansion Coefficient

  1. Low in-plane expansion coefficient is stable over the entire circuit processing temperature range.

Anti-CAF Properties

  1. Anti-CAF properties.

Précédent:

Suivant:

Laisser une réponse

Laisser un message