LOGO UGPCB
UGPCB Company Specializes in RF PCB Manufacturing
UGPCB company specialized in RF PCB manufacturing for more than 17 years in China. We understand the significant impact of the proper RF material on the board’s performance. Parameters like RF microwave energy levels, operating frequency, operating temperature range, current, and voltage are crucial when selecting suitable material for high-frequency PCB fabricating.
Material Expertise and Stock Assurance
Getting familiar with RF PCB material is one of our jobs. Check below material listing for reference. We have enough of them in stock to ensure fast delivery.
Quality Assurance and Customer Satisfaction
The confidence towards our product quality stems from our experienced engineers and production team, who cooperate closely with our QA department to provide a qualified product. More and more repeat orders speak to our customers’ satisfaction. Quality is the core value of our company, and we recognize its importance for long-term business. We are grateful to our customers for accompanying us in developing and improving our capacity and technical field over the past 17 années.
List of RF/Microwave PCB Materials
RF/Microwave PCB materials include Rogers RO4350B / RO3003 / RO4003 / RO3006 / RT/Duroid 5880 / RT5870, and others like Arlon, Isola, Taconique, PTFE F4BM, and Teflon material.
Hybrid PCB Materials
Hybrid PCB materials (Mixed dielectric / Laminate) include Rogers RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, and others.
RF Microwave PCB Applications and Specifications
RF Microwave PCBs are used in various fields such as Consumer Electronics, Military/Space, High power, Médical, Automobile, and Industrial. Specifications include surface finishing options like OSP, ACCEPTER, HASL LF, plated gold, flash gold, immersion tin, immersion silver, electrolytic gold, and others. Capacity includes golden finger, heavy copper, blind/buried via, contrôle d'impédance, filled with resin, carbon ink, backdrill, countersink, depth drilling, half plated hole, pressfit hole, peelable blue mask, peelable solderstop, thick copper, and oversize. Materials include Rogers RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, Arlon, Isola, Taconique, PTFE F4BM, and Teflon. Layers range from 2L to 30L. Constante diélectrique (NSP) values include 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, et 10.2. Applications include Consumer Electronics, Military/Space, Antenna & Communications System, High Power, Médical, Automobile, Industrial, Handheld device cellular, Wifi Antenna, Telematics and infotainment, Wifi/Computing/Radar/Power.
Material Model Corresponding to RO4003C PCB
Material models corresponding to RO4003C PCB include RO4450F, 4450B BOND PLY 14X24 UNPUNCHED SHEET, 4450B BOND PLY 24X20 UNPUNCHED SHEET, and various others. Note that RO4003C is not UL certified.
Copper Foil Manufacturing Changes Due to EU and REACH Regulations
Copper foil manufacturers are eliminating the use of arsenic acid in their manufacturing processes under EU and REACH regulations. This legislation made it difficult to use arsenic compounds in the manufacture of copper foil and ultimately banned the purchase of arsenic completely in the European Union. The Rogers RO4003C PCB material is affected by this, and the standard electrodeposited copper foil used for RO4003C PCB material will be replaced by a new grade of copper foil that complies with EU regulations during 2020.
