SiP Package Substrate

When Product Functions Increase and Space is Limited

When product functions are increasing, and the space layout of the circuit board is limited, and no more components and circuits can be designed, the designer will integrate this PCB board function with various active or passive components on an IC chip. This approach is used to complete the design of the entire product and is known as SIP (Système dans le package) application.

SiP Package IC Substrate PCB Board Advantages

Small Size

In the same function, the SIP module integrates a variety of chips. Compared to relatively independently packaged ICs, SIP can save PCB space.

Fast Time

The SIP module board is a system or subsystem used in a larger system. During the debugging stage, it can complete predictions and pre-audits faster.

Faible coût

Although the price of a SIP module is more expensive than a single part, the reduced PCB space, low failure rate, low test cost, and simplified system design result in lower overall costs.

High Production Efficiency

Through the integration and separation of passive components in SIP, the defect rate is reduced, thereby increasing the overall product yield. The module adopts high-level IC packaging technology to further reduce the system failure rate.

Simplify System Design

SIP integrates complex circuits into modules, reducing the complexity of PCB circuit design. The SIP module provides a quick replacement function, allowing system designers to easily add required functions.