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Twelve-layer 2+N+2 HDI board - et

PCB HDI/

Twelve-layer 2+N+2 HDI board

name: Twelve-layer 2+N+2 board

Plaque: FR4

Calques: 12L

Matériel: ISOLE

Plate Thickness: 2.0mm

Copper thickness of inner and outer layers: 1once

Diamètre minimum du trou: 0.1mm

Traitement de surface: Immersion Or

Line width: 0.1mm

Line distance: 0.1mm

BGA pad: 0.15mm

  • Détails du produit

General Guidelines

Ground Planes

UN. Ground planes are preferred because of their ability to route signals in a microstrip configuration.

Low Impedance and Low Noise

B. Ground plane based 12-layer PCB with low ground impedance and low noise.

High-Speed Signal Tracing

C. The middle layer between layers is used as the trace for high-speed signals. Even in adjacent planes, the signal layers must be tightly packed with each other.

Adjacent Layer Placement

D. You must place the plane and signal layers in adjacent layers.

Tight Coupling of Planes

E. The large plan and power planes are tightly coupled together.

Expert Design Team Focus

Signal Layer Adjacent to Plane

  • The signal layer should always be adjacent to the plane.

Power Plane as Return Path

  • The power plane can be used for the return path of the signal.

Tight Coupling of Signal Layers

  • Signal layers should be tightly coupled to their adjacent planes.

Determining Signal Return Portion

  • Determine the return portion of the signal.

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