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F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates - et

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F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates

F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates

F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.

Technical Specifications

Apparence

The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.

Types

  • F4B255
  • F4B265

Constante diélectrique

  • 2.55
  • 2.65

Available Dimensions (mm)

  • 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
  • 840×840, 1200×1000, 1500×1000
  • Custom dimensions are available upon request.

Épaisseur du cuivre

  • 0.035µm, 0.018µm

Thickness and Tolerance (mm)

Laminate Thickness Tolérance
0.17, 0.25 ±0.025
0.5, 0.8, 1.0 ±0.05
1.5, 2.0 ±0.05
3.0, 4.0, 5.0 ±0.09

The laminate thickness includes the copper thickness. Custom dimensions are available upon request.

Mechanical Strength

Épaisseur (mm) Maximum Warp Single Side Double Side
0.25~0.5 0.030 0.050 0.025
0.8~1.0 0.025 0.030 0.020
1.5~2.0 0.020 0.025 0.015
3.0~5.0 0.015 0.020 0.010

Cutting/Punching Strength:

  • Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, pas de délaminage.
  • Épaisseur >1mm: No burrs after cutting, minimum space between punching holes is 1.10mm, pas de délaminage.

Peel Strength (1oz copper)

  • Normal State: ≥15N/cm; No bubbles or delamination.
  • After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 secondes).

Chemical Properties

These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.

Electrical Properties

Nom Test Condition Unit Value
Density Normal state g/cm³ 2.2~2.3
Moisture Absorption Dip in distilled water 20±2°C for 24 heures % ≤0.1
Operating Temperature High-low temperature chamber °C -50~+260
Conductivité thermique W/m/k 0.3
CTE (typical) 0~100°C ppm/°C x:16, y:21 z:186
Shrinkage Factor 2 hours in boiling water % ≤0.0002
Surface Resistivity 500V DC, Normal state M·Ω ≥1*10⁴
Constant humidity and temperature ≥5*10³
Volume Resistivity Normal state MΩ.cm ≥1*10⁶
Constant humidity and temperature ≥9*10⁴
Pin Resistance 500VCC, Normal state ≥5*10⁴
Constant humidity and temperature ≥5*102
Surface Dielectric Strength Normal state, d=1mm (Kv/mm) ≥1.2
Constant humidity and temperature ≥1.1
Constante diélectrique 10GHZ, εr 2.55/2.65 (±2%)
Dissipation Factor 10GHZ, tgδ ≤1*10⁻³

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