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F4BK-1/2 Teflon Woven Glass Fabric Copper-Clad Laminates
F4BK-1/2 Teflon woven glass fabric copper-clad laminates is a composite of glass cloth, polytetrafluoroethylene resin and polytetrafluoroethylene, laminated in accordance with scientific formula and strict technological process. This product has certain advantages over the F4B series in terms of electrical performance (a wider range of dielectric constant).
Technical Specifications
Apparence
Meet the specification requirements for the laminate of microwave PCB by National and Military Standards.
Types
- F4BK225
- F4BK265
Constante diélectrique
- 2.25
- 2.65
Dimension(mm)
- 300*250
- 380*350
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 1200*1000
- 1500*1000 For special dimension, customized laminates are available.
Thickness and Tolerance(mm)
| Laminate Thickness | Tolérance |
|---|---|
| 0.25 | ±0.025 |
| 0.5 | ±0.05 |
| 0.8 | ±0.05 |
| 1.0 | ±0.05 |
| 1.5 | ±0.05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ±0.10 |
| 5.0 | ±0.10 |
The laminate thickness includes the copper thickness. For special dimensions, customized laminates are available.
Mechanical Strength
Warp
| Épaisseur(mm) | Maximum Warp |
|---|---|
| Original board | Single side |
| 0.25～0.5 | 0.030 |
| 0.8～1.0 | 0.025 |
| 1.5～2.0 | 0.020 |
| 3.0～5.0 | 0.015 |
Cutting/Punching Strength
| Thickness1mm | No Burrs After Cutting | Minimum Space Between Two Punching Holes | No Delamination |
|---|---|---|---|
| 0.55mm | |||
| >1mm | 1.10mm |
Peel Strength (1oz copper)
- Normal state: ≥12N/cm; No bubbles or delamination. Peel strength ≥10N/cm (in constant humidity and temperature, and kept in melting solder at 260°C±2°C for 20 secondes).
Chemical Property
According to the properties of the laminate, the chemical etching method for PCB can be used. The dielectric properties of the laminate are not changed. The plating through hole can be done but the sodium treatment or the plasma treatment must be used.
Electrical Property
| Nom | Test Condition | Unit | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.2～2.3 |
| Moisture Absorption | Dip in distilled water 20±2°C for 24 heures | % | ≤0.1 |
| Operating Temperature | High-low temperature chamber | °C | -50°C～+250°C |
| Conductivité thermique | W/m/k | 0.3 | |
| CTE (typical) | ppm/°C | ||
| εr :2.1~2.3 | 25(x), 34(y), 240(z) | ||
| εr :2.3~2.9 | 16(x), 21(y), 186(z) | ||
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| Surface Resistivity | M·Ω | ||
| Normal state | ≥3*10^4 | ||
| Constant humidity and temperature | ≥8*10^3 | ||
| Volume Resistivity | MΩ·cm | ||
| Normal state | ≥2*10^6 | ||
| Constant humidity and temperature | ≥2*10^5 | ||
| Surface Dielectric Strength | d=1mm(Kv/mm) | ||
| Normal state | ≥1.2 | ||
| Constant humidity and temperature | ≥1.1 | ||
| Constante diélectrique | |||
| 10GHZ | εr | ||
| 2.25,2.65 | |||
| Dissipation Factor | tgδ | ||
| ≤1.5*10^-3 |
This structured format ensures that each section is clearly defined and logically organized, making it easier to understand the key points and specifications of the F4BK-1/2 Teflon woven glass fabric copper-clad laminates.
