Rogers RO4700 series PCB board material

New Antenna Level PCB Materials: RO4725JXR, RO4730JXR, and RO4730G3

Rogers launched the RO4725JXR, RO4730JXR, and RO4730G3 antenna level PCB materials to meet current and future higher performance requirements in active antenna arrays, small base stations, 4G base transceivers, Internet des objets (IdO) devices, and emerging 5G wireless system applications.

Flame Retardant RO4730G3 Thermosetting Laminate Material

This flame retardant (UL 94V-0) RO4730G3 thermosetting laminate material is a derivative of Rogers’ long trusted and popular circuit material for base station antenna applications. It has a low dielectric constant of 3.0, which is preferred by antenna designers, and a z-direction dielectric constant deviation of ± 0.05 à 10 GHz.

Specifications and Features of RO4725JXR, RO4730JXR, and RO4730G3

RO4730G3 Laminate Composition and Properties

• Made of ceramic hydrocarbon material and low loss LoPro Copper foil.
• Provides excellent passive intermodulation performance (usually better than -160 DBC).
• 30% lighter than PTFE with high glass transition temperature (TG) over +280 °C.
• Compatible with automatic assembly process.
• Low coefficient of thermal expansion (CTE) in Z direction (30.3 ppm/C) from -55 °C to +288 °C.
• Better flexural strength than RO4000JXR material due to lead-free process resistance.

Stable Performance Across Temperature Range

• The performance of RO4730G3 is stable with temperature.
• Coefficient of thermal expansion (CTE) matches copper with very low rate of thermal change in the Z direction of the dielectric constant.
• High frequency loss is very low, with a loss factor of 0.0023 à 2.5 GHz and 0.0029 à 10 GHz.

Applications and Cost-Effectiveness

• Practical and cost-effective solution for current 4G, IoT wireless devices, and future 5G wireless devices.
• Combined with the right materials, offers the best combination of price, performance, et durabilité.
• Compatible with conventional RF-4700 laminate with no special requirements for high-temperature soldering.
• Economical alternative to PTFE antenna material, aiding designers in achieving high cost performance.

Advantages of RO4730G3 PCB Material

• Cost advantage.
• High Performance for 5G and IoT: Suitable for PCB antennas and active antenna arrays.
• Meets High Cost Performance Needs: Tailored for 4G, 5G, and IoT applications requiring high cost performance.