TU-768 High Speed Digital (HSD) PCB Materials

High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; Préimprégné: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (Zone d'intérêt) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

• Electronique grand public
• Server, workstation
• Automobile

Key Features

• Lead Free process compatible
• Excellent coefficient of thermal expansion
• Anti-CAF property
• Superior chemical and thermal resistance
• Fluorescence for AOI
• Moisture resistance

Property

Industry Approvals

• IPC-4101E Type Designation: /98, /99, /101, /126
• IPC-4101E/126 Validation Services QPL Certified
• UL Designation – ANSI Grade: FR-4.0
• UL File Number: E189572
• Flammability Rating: 94V-0
• Maximum Operating Temperature: 130°C

Standard Availability

• Épaisseur: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
• Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
• Prepregs: Available in roll or panel form
• Glass Styles: 106, 1080, 2113, 2116, 1506 et 7628 etc..