LOGO UGPCB
Introduction
Tuc TU-900 and TU-900P are high Tg 260°C halogen-free multilayer PCB materials. TU-900 serves as the Core, while TU-900P functions as the PP.
Composition and Properties
TU-900 high Tg260°C PCB material is crafted from a BT-like high-performance resin system and alkali-free glass fabric. It boasts halogen-free multilayer PCB design, high elastic modulus, haute fiabilité, low Dk/Df, and low loss electrical properties.
Design and Application
TU-900 and TU-900P multilayer PCB materials are tailored for high-reliability multi-layer PCB boards, IC substrates or SiP package substrates, radio frequency PCBs, and ultra-thin HDI PCB boards. They are suitable for PCB boards that demand strict X, Y dimensional stability, low board deformation, or operation in excessively harsh environments.
Additional Properties
TU-900 PCB material further exhibits excellent chemical resistance, high rigidity, low thermal expansion, and outstanding long-term reliability and CAF performance.
Data Sheet
Tuc TU-900 / TU-900P PCB materials Data Sheet
Industry Certification
Tuc TU-900 and TU-900P possess industry certification IPC-4101 with model names /127, /128, /130. They have a UL name-no ANSI rating, UL file number E189572, a flammability rating of 94V-0, and a maximum operating temperature of 150°C.
Standard Availability
Tuc TU-900 and TU-900P are available in thicknesses ranging from 0.0012″ [0.03mm] to 0.062″ [1.58mm], in sheet or panel form. Copper foil cladding ranges from 1/3 à 3 ounces. Prepreg is available in roll or panel form, with Glass styles including 1017, 1027, 1037, 1067, 1078, 3313, et 2116, among others available upon request.
