LOGO UGPCB
Introduction
UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.
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DS-7409 Variants
DS-7409
DS-7409S (N)
Material Properties of DS-7409
Tg (Température de transition du verre)
Property: Tg
Unité: degré Celsius
Test Condition: DSC
Typical Value: 170
Test Method: IPC-TM-650.2.4.25c
TMA (Thermomechanical Analysis)
Property: TMA
Unité: degré Celsius
Test Condition: N/A
Typical Value: 165
Test Method: IPC-TM-650.2.4.24c
CTE Z-axis (Coefficient de dilatation thermique)
Property: CTE Z-axis
Unité: ppm/degree Celsius
Test Condition: Ambient to Tg
Typical Value: 41
Test Method: IPC-TM-650.2.4.41
Z-axis Expansion
Property: Z-axis Expansion
Unité: %
Test Condition: 50 degré Celsius à 260 degré Celsius
Typical Value: 3.3
Test Method: IPC-TM-650.2.4.41
Decomposition Temperature (5% wt loss)
Property: Decomposition Temperature
Unité: degré Celsius
Test Condition: TGA
Typical Value: 295
Test Method: IPC-TM-650.2.4.40
T-260 & T-288 (Thermomechanical Analysis)
Property: T-260
Unité: min
Test Condition: TMA
Typical Value: 7
Test Method: IPC-TM-650.2.4.24.1
Property: T-288
Unité: min
Test Condition: TMA
Typical Value: –
Test Method: IPC-TM-650.2.4.24.1
Constante diélectrique & Dissipation Factor
Property: Constante diélectrique (Resin content 50%)
Unité: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 4.2
Test Method: IPC-TM-650.2.5.5.9
Property: Dissipation Factor (Resin content 50%)
Unité: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 0.015
Test Method: IPC-TM-650.2.5.5.9
Peel Strength
Property: Peel Strength (Standard profile 1oz)
Unité: N/mm
Test Condition: Condition A
Typical Value: 2.0
Test Method: IPC-TM-650.2.4.8
Water Absorption
Property: Water Absorption
Unité: %
Test Condition: E-24/50+D-24/23
Typical Value: 0.12
Test Method: IPC-TM-650.2.6.2.1
