Doosan DS-7409 HG (KQ) IC Package substrate material

Introduction

UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.

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DS-7409 Variants

DS-7409
DS-7409S (N)

Material Properties of DS-7409

Tg (Température de transition du verre)

Property: Tg
Unité: degré Celsius
Test Condition: DSC
Valeur typique: 170
Test Method: IPC-TM-650.2.4.25c

TMA (Thermomechanical Analysis)

Property: TMA
Unité: degré Celsius
Test Condition: N/A
Valeur typique: 165
Test Method: IPC-TM-650.2.4.24c

CTE Z-axis (Coefficient de dilatation thermique)

Property: CTE Z-axis
Unité: ppm/degree Celsius
Test Condition: Ambient to Tg
Valeur typique: 41
Test Method: IPC-TM-650.2.4.41

Z-axis Expansion

Property: Z-axis Expansion
Unité: %
Test Condition: 50 degré Celsius à 260 degré Celsius
Valeur typique: 3.3
Test Method: IPC-TM-650.2.4.41

Decomposition Temperature (5% wt loss)

Property: Decomposition Temperature
Unité: degré Celsius
Test Condition: TGA
Valeur typique: 295
Test Method: IPC-TM-650.2.4.40

T-260 & T-288 (Thermomechanical Analysis)

Property: T-260
Unité: min
Test Condition: TMA
Valeur typique: 7
Test Method: IPC-TM-650.2.4.24.1

Property: T-288
Unité: min
Test Condition: TMA
Valeur typique: –
Test Method: IPC-TM-650.2.4.24.1

Constante diélectrique & Facteur de dissipation

Property: Constante diélectrique (Resin content 50%)
Unité: C-24/23/50(1GHz)
Test Condition: N/A
Valeur typique: 4.2
Test Method: IPC-TM-650.2.5.5.9

Property: Facteur de dissipation (Resin content 50%)
Unité: C-24/23/50(1GHz)
Test Condition: N/A
Valeur typique: 0.015
Test Method: IPC-TM-650.2.5.5.9

Résistance à l'écoulement

Property: Résistance à l'écoulement (Standard profile 1oz)
Unité: N/mm
Test Condition: Condition A
Valeur typique: 2.0
Test Method: IPC-TM-650.2.4.8

Absorption d'eau

Property: Absorption d'eau
Unité: %
Test Condition: E-24/50+D-24/23
Valeur typique: 0.12
Test Method: IPC-TM-650.2.6.2.1