LOGO UGPCB
Nanoprotezione al plasma (PECVD) Principle
Plasma nano-protection (PECVD) is a method that utilizes plasma-enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition) technology to achieve nanoscale protection. The PECVD technique ionizes gases containing thin film constituent atoms through microwave or radio frequency methods, forming plasma locally. Due to the high chemical reactivity of the plasma, reactions occur easily, allowing for the deposition of nanoscale films with dustproof, waterproof, and anticorrosive functions on PCBs or PCBAs.
PECVD Application Scenarios
PECVD technology can be used to prepare various thin film materials, such as silicon nitride films, silicon carbide films, zinc oxide films, ecc. These thin film materials have important application value in photoelectronic devices, microelectronic devices and sensors. By controlling the deposition conditions and precursor concentration, PECVD technology can form a nano-level coating on the surface of protected electronic devices such as PCB or PCBA. This coating may have excellent protective performance, such as waterproof, antifouling, anticorrosion, antibacterial, and antioxidant properties. This coating can also be used for protection of various outdoor equipment, dispositivi medici, ecc.
UGPCB, dopo uno sviluppo a lungo termine, non solo ha un design leader di PCB e PCBA, prototipazione, e capacità produttive, ma ha anche un'attività leader nel settore della nanoprotezione al plasma PECVD, fornitura di servizi di nanoprotezione al plasma a lungo termine per prodotti di circuiti stampati per l'azienda e altri produttori di PCB o PCBA.
Whatsapp
Scansiona il codice QR per avviare una chat WhatsApp con noi.