Progettazione PCB

Core Advantages of Our PCB Design Services

As a leading one-stop PCB service provider, we have over a decade of expertise in PCB design, supported by a highly skilled hardware development team and comprehensive end-to-end design capabilities. Leveraging advanced EDA software tools (such as Cadence Allegro and Mentor Xpedition) and simulation verification platforms, we specialize in high-complexity, high-reliability PCB designs for industries including consumer electronics, controllo industriale, elettronica automobilistica, and medical devices. By adhering to strict IPC standards and DFM (Design for Manufacturability) guidelines, we ensure that our designs achieve both performance optimization and mass production feasibility.

Technical Capabilities and Innovation Directions

Interconnessione ad alta densità (ISU) Progetto

To meet the demands of miniaturized devices, we support 6-20 layer HDI board designs, utilizing blind/buried vias and laser drilling technology to achieve precise routing with line width/spacing ≤3mil. This capability is ideal for ultra-thin applications such as 5G communication modules and smart wearable devices.

High-Speed Signal Integrity (SI) Optimization

Using HyperLynx signal simulation tools, we address impedance matching and crosstalk suppression in GHz-level high-frequency signal transmission. Particularly in server motherboards and AI accelerator cards, we ensure signal delay is controlled within ±5ps and bit error rates remain below 1E-12.

Thermal Management and EMC Design

By combining thermal simulation analysis and electromagnetic compatibility optimization, we employ copper-based boards and stacked thermal vias for high-power modules and automotive drive systems, reducing temperature rise by 15%-30%. Inoltre, our EMI shielding layer layouts ensure compliance with CISPR 25 standard.

Showcase of Typical PCB Design Cases

Case 1: On-Board Charger (OBC) Main Control Board for New Energy Vehicles

• Background: The client required a compact OBC supporting an 800V high-voltage platform, integrating bidirectional DC/AC conversion and CAN communication within a 150mm×100mm board area.
• Solution: A 4-layer FR4 board was used, with power and signal grounds separated during layout. MOSFET drive loops were optimized through simulation to reduce switching noise, and metallized thermal via arrays were added to ensure a temperature rise of ≤40℃ under 30A continuous current.
• Outcome: The design passed automotive-grade EMC testing on the first attempt, achieving a mass production yield of 99.2%. It is now in mass production for a leading domestic new energy vehicle manufacturer.

Case 2: Industrial IoT Edge Computing Gateway

• Challenge: Multi-band interference suppression for dual Gigabit Ethernet ports and a Wi-Fi 6 module, along with stability across a wide temperature range of -40℃ to 85℃.
• Design Highlights: A 6-layer stack-up structure was used, with stripline routing to isolate RF areas. Ceramic capacitors and low-temperature drift resistors were employed to match thermal expansion coefficients, while common-mode chokes and TVS arrays were added to enhance surge immunity to 4kV.
• Risultato: The product achieved IEC 61000-4-5 certification and demonstrated zero failures in a smart factory project with over 100,000 nodes.

End-to-End Services Empowering Clients

From schematic design and layout to Gerber file output, we provide one-stop PCB design and manufacturing services, collaborating with PCBA assembly teams to complete SMT production verification. Our PLM system ensures version control and change traceability, reducing design cycles by 20%-35%. For specialized substrate requirements involving PEVCD (Plasma-Enhanced Chemical Vapor Deposition) processes, we partner with PCB material suppliers to customize copper-clad laminates with adjustable dielectric constants (Non so), driving innovation in high-frequency and high-thermal scenarios.

Collaboration Value and Industry Recognition

We have delivered over 5,000 PCB design projects, with 32% being high-reliability products for automotive electronics and medical devices. Our clients include global Top 50 electronics manufacturers. Moving forward, we will continue to invest in cutting-edge technologies such as AI-assisted routing and 3D PCB-structure co-design to deliver higher cost-performance solutions for our clients.