LOGO UGPCB
Applications Overview
- Preamplifiers
- Satellite Antennas
- GPS Tracking Devices
- SAN Storage
- AC Drives
- GSM Signal Boosters
- Mobile Broadband Routers
- 220V Inverters
- Memory Modules
- Car Dashboards
10-Layer Manufacturing Process
Material Preparation
- Cut material to size/bake material
Drilling and Inner Layer Patterning
- Inner layer drilling
- Inner layer pattern transfer
- Inner layer circuit inspection
- Etch/stripping
- Etch inspection
Surface Preparation and Laminating
- Browning
- Prepreg preparation
- Layers Pressing
- Cutting copper foil
- Positioning
- Laminazione
Drilling and Hole Preparation
- Target hole
- Perforazione
- Desmear removal
- Immersion copper
Circuit Formation
- Image and text transfer
- Circuit inspection
- Copper and tin plating
- Film removal Etching
- Tin removal
- Etching inspection
Quality Control Tests
- Dielectric inspection test
- Solder mask inspection
Final Assembly and Finishing
- Text
- Baking pan
- Spray tin, Immersion gold, Immersion tin
- Shape
- V cut
Final Product Inspection and Packaging
- Finished Product Test
- Antioxidant
- Final Inspection
- Finished Product Extraction
- Packaging
