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16-Livello 2+N+2 PCB ad alta precisione - UGPCB

Progettazione PCB HDI/

16-Livello 2+N+2 PCB ad alta precisione

Nome: 16-layer two-stage high-precision PCB design

Piatto: TG170 /TG180, F4BM, FR4, FR1-4, ecc.

Strati designabili: 1-32 strati

Larghezza minima della linea e spaziatura della linea: 3mil

Apertura laser minima: 4mil

Apertura meccanica minima: 8mil

Spessore di lamina di rame: 18-175cm (standard: 18CM35CM70CM)

Forza di buccia: 1.25N/mm

Diametro del foro di punzonatura minimo: lato singolo: 0.9mm/35mil

Diametro del foro minimo: 0.25mm/10mil

Tolleranza di apertura: ≤φ0,8 mm ± 0,05 mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

  • Dettagli del prodotto

Overview of 16-Layer Stack PCB

A 16-layer stack has 16 layers of routing and is typically used for high-density designs.

Routing Challenges and Solutions

Routing Challenges

In EDA applications, routing techniques often fail to route the design.

Soluzione: Adding Multiple Layers

That’s why manufacturers add multiple layers to accommodate the complexity of high-density designs.

Specifications of 16-Layer PCB Fabrication

Composition

  • Made of 16 strati
  • Made of halogen-free materials, aluminum, CEM, and FR

Plate Thickness

  • Extended to 7 mm

Board Size

  • Maximum finished board size is 500 X 500 mm

Finishes

  • Halogen-free gold and silver plated

UGPCB: High-Quality Fabrication

UGPCB offers high-quality fabrication of 16-layer stack PCBs, ensuring reliability and performance for high-density designs.

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