6-layer high-frequency hybrid board

Structure and Composition

The high-frequency hybrid pcb board splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate, and the second layer of solder resist ink layer are also part of its structure.

Division of Areas

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the high-frequency area inlay should be located in a fixed position.

Utility Model

The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.

Independent Arrangement of High-Frequency Area

The utility model discloses that the high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized and the production cost is reduced.