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8-progettazione PCB/PCBA di comunicazione a strati - E

Progettazione PCB multistrato/

8-progettazione PCB/PCBA di comunicazione a strati

Nome: 8-progettazione PCB/PCBA di comunicazione a strati

Sheet: IT180, F4BM, FR4, FR1-4, ecc.

Designable layers: 1-32 strati

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

  • Dettagli del prodotto

Communications PCBs Applications

Communications PCBs are also used in general telecommunications systems such as cell towers, satellites, high-speed routers and servers, and commercial telephony. Telecom PCBs are also frequently used to control LED displays and indicators.

Structure and Composition of High-Frequency Hybrid Splint

Base Plate and Wire Layers

The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top.

Solder Resist Ink Layer and Substrate Areas

The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position.

Functionality and Material Usage

Utility Model Description

The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.

High-Frequency Area Arrangement

The utility model discloses that the high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized and the production cost is reduced.

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