LOGO UGPCB
Definition of HDI PCB
High Density Interconnect (ISU) is simply a PCB with a higher number of interconnects in the smallest footprint. This leads to miniaturization of the circuit board. Components are placed closer together and board space is significantly reduced, but functionality is not compromised.
Characteristics of HDI PCB
More precisely, a PCB with an average of 120 A 160 pins per square inch is considered an HDI PCB. HDI designs combine dense component placement and versatile routing. HDI popularized microporous technology, creating denser circuits by implementing microvias, buried vias, and blind vias. Reduced drilling of copper is a feature of HDI designs.
Advantages of HDI PCB
Extraordinary Versatility
HDI boards are ideal when weight, space, reliability, and performance are the main concerns.
Compact Design
The combination of blind, buried, and micro vias reduces board space requirements.
Better Signal Integrity
HDI utilizes via-in-pad and blind via technology. This helps keep components close to each other, reducing signal path lengths. HDI technology removes through-hole stubs, thus reducing signal reflections, thereby improving signal quality. Perciò, it significantly improves signal integrity due to shorter signal paths.
High Reliability
The implementation of stacked vias makes these boards a super barrier against extreme environmental conditions.
Cost-effective
The functionality of a standard 8-layer through-hole board (standard PCB) can be reduced to a 6-layer HDI board without compromising the quality. This makes HDI PCBs a cost-effective solution.
