High-speed and high-density PCBA design Nome: High-speed and high-density PCBA design Plate: TG170 /TG180, F4BM, FR4, FR1-4, ecc. Designable layers: 1-32 strati Minimum line width and line spacing: 3mil Minimum laser aperture: 4mil Minimum mechanical aperture: 8mil Copper foil thickness: 18-175цm (standard: 18цm35цm70цm) Peel strength: 1.25N/mm Minimum punching hole diameter: single side: 0.9mm/35mil Minimum hole diameter: 0.25mm/10mil Aperture tolerance: ≤φ0.8mm±0.05mm Invia richiesta Ottieni un preventivo immediato Dettagli del prodotto Definition of High-Speed PCB Design Insomma, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board. Key Physical Properties Layout Packaging Layer Stacking Interconnects Prec: 14-layer 25G high-speed HDI PCB design Prossimo: 12-layer automotive high-speed backplane design Prodotti correlati 24-layer high-density high-speed PCB 12-layer automotive high-speed backplane design 14-layer 25G high-speed HDI PCB design High Speed Server Backplane PCB Design Communication terminal circuit board design 5G communication circuit board design Artificial intelligence circuit board design High Frequency High Speed PCB Design Prodotti caldi 12Scheda L 3+N+3 HDI Rogers RO3010 per misuratore di livello radar a onda guidata PCBA di controllo del dispositivo medico PCB in teflon ad alta frequenza PCBA per ricarica auto scheda radar