LOGO UGPCB
Hybrid PCB is commonly used in microwave RF series products
Con il rapido sviluppo della tecnologia di comunicazione elettronica, in order to achieve high-speed and high-fidelity signal transmission, more and more microwave radio frequency PCBs are used in communication equipment. The dielectric materials used in high-frequency hybrid circuit boards have excellent electrical properties and good chemical stability, which are mainly manifested in the following four aspects.
1. Hybrid PCB has the characteristics of low signal transmission loss, breve tempo di ritardo della trasmissione, and low signal transmission distortion.
2. Eccellenti proprietà dielettriche (si riferisce principalmente a DK costante dielettrico relativo basso, fattore di perdita dielettrica a basso contenuto di df). Inoltre, le proprietà dielettriche (DK, Df) rimangono stabili in cambiamenti ambientali come la frequenza, humidity and temperature.
3. Controllo dell'impedenza caratteristica ad alta precisione.
4. Il PCB ibrido ha un'eccellente resistenza al calore (Tg), processability and adaptability.
Microwave high-frequency hybrid PCBs are widely used in communication equipment such as wireless antennas, stazione base che riceve antenne, amplificatori di potenza, sistemi radar, sistemi di navigazione, ecc.
Based on one or more factors such as cost saving, improving bending strength and controlling electromagnetic interference, high-frequency lamination design must use high-frequency prepreg with low resin flow and FR-4 substrate with smooth dielectric surface. High-frequency composite laminate. In questo caso, there is a great risk of product adhesion control during the pressing process.
Microwave high-frequency hybrid PCB stacking method and characteristics
1. A high-frequency hybrid PCB controllable depth composite lamination structure, the high-frequency hybrid PCB includes L1 copper layer (high-frequency sheet), L2 copper layer (PP sheet), L3 copper layer (epoxy resin substrate), L4 copper layer in sequence; L2, L3, L4 copper layers are provided with slots of the same size at the same position; L4 copper layer is arranged with three-in-one buffer material from inside to outside, and steel plate and kraft paper are stacked from outside to outside in sequence; aluminum plate, steel plate, and kraft paper are stacked on L1 copper layer from inside to outside.
2. According to the first feature, the three-in-one buffer material is a buffer material sandwiched between two layers of release film.
3. According to the first feature, the laminated structure of the high-frequency board controlled deep hybrid board of the present invention is characterized in that the high-frequency sheet is a polytetrafluoroethylene board.
The expansion and contraction characteristics of the high-frequency hybrid PCB composite board are different from those of the ordinary epoxy resin substrate, so the warping and shrinkage of the board are difficult to control, and the processing method of first grooving and then pressing will cause the problem of metal dents on the board. The three-in-one buffer material is set on one side of the groove, and the buffer material can be filled into the groove hole during pressing to avoid the problem of dents. Kraft paper buffer pressure is set on both sides of the cardboard to balance the heat transfer uniformly, and the steel plate is set to ensure uniform heat conduction during pressing, so that the pressing is flat, and the heat and pressure during the pressing process are balanced, so as to better control the curvature and expansion of the board.
With the rapid development of 5G communication technology, higher frequency requirements are put forward for communication equipment. There are many microwave high-frequency hybrid PCBs on the market. The manufacturing technology of these microwave high-frequency hybrid PCBs also puts forward higher requirements. We have been specialized in UGPCB processing for more than 10 years and can provide multi-layer hybrid PCB manufacturing services. We have all the equipment required for the entire process of multi-layer hybrid PCB production, comply with the ISO9001-2000 international standard management system, and have passed the iatf16949 and ISO 14001 system certification. Our products have passed UL certification and comply with IPC-A-600G and IPC-6012A standards. We can provide high-quality, high-stability, and high-adaptability microwave high-frequency hybrid PCB samples and batch services.
