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Progettazione di circuiti con apparecchiature di rete - UGPCB

Progettazione PCB ad alta potenza/

Progettazione di circuiti con apparecchiature di rete

Nome: Progettazione di circuiti con apparecchiature di rete

Strati designabili: 1-32 strati

Larghezza minima della linea e spaziatura della linea: 3mil

Apertura laser minima: 4mil

Apertura meccanica minima: 8mil

Spessore di lamina di rame: 18-175cm (standard: 18CM35CM70CM)

Forza di buccia: 1.25N/mm

Diametro del foro di punzonatura minimo: lato singolo: 0.9mm/35mil

Diametro del foro minimo: 0.25mm/10mil

Tolleranza di apertura: ≤φ0,8 mm ± 0,05 mm

Hole tolerance: ±0.05mm

  • Dettagli del prodotto

Various Names of Circuit Boards

The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuito, Scheda PCB, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, Thin circuit boards, stampato (copper etching technology) circuit boards, ecc.

Importance of Circuit Boards

The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

Types of Circuit Boards

Circuiti stampati (PCB)

Circuit boards can be called printed circuit boards.

FPC Circuit Boards

FPC circuit boards (also known as flexible circuit boards) are a kind of high reliability made of polyimide or polyester film as the base material. They are an excellent flexible printed circuit board with the characteristics of high wiring density, peso leggero, spessore sottile, and good bendability.

Soft-Rigid Board

The birth and development of the flexible and rigid combination board—FPC and PCB, gave birth to the combination of flexible and rigid board this new product. Perciò, the soft-rigid board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards according to relevant process requirements through lamination and other processes.

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