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Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, good PCB processability, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRAM, AP, PA, Dual CM, Fingerprint, and RF Module.
Specifications of SI10U
| Items | Conditions | Unità | SI10U(S) |
|---|---|---|---|
| Tg | DMA | gradi Celsius | 280 |
| Td | 5% wt. loss | gradi Celsius | >400 |
| CTE (X/Y-axis) | Before Tg | ppm/grado Celsius | 10 |
| CTE (Z-axis) | α1/α2 | ppm/grado Celsius | 25/135 |
| Costante dielettrica (1GHz) | – | – | 2.5.5.9 |
| Fattore di dissipazione (1GHz) | – | – | 2.5.5.9 |
| Forza della pelatura | 1/3 OZ, VLP Cu | N/mm | 0.80 |
| Solder Dipping | @288 degree Celsius | min | >=30 |
| Young’s Modulus | 50 gradi Celsius | GPa | 26 |
| Young’s Modulus | 200 gradi Celsius | GPa | 23 |
| Flexural Modulus (50 gradi Celsius) | GPa | 32 | |
| Flexural Modulus (200 gradi Celsius) | GPa | 27 | |
| Assorbimento d'acqua (A) | % | 0.14 | |
| Assorbimento d'acqua (85 degree Celsius/85%RH,168Hr) | % | 0.35 | |
| Flammability | UL-94 Rating | V-0 | |
| Thermal Conductivity | W/(m.K) | 0.61 | |
| Colore | – | Nero |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
