TPH-1/2 microwave composite dielectric copper-clad substrate

TPH-1/2: A Revolutionary Laminate for Microwave Circuits

Unmatched Performance and Reliability

TPH-1/2 stands out in the microwave circuit industry due to its unique composition of both inorganic and organic materials, combined with a special process and compounding. This innovative approach results in a substrate that offers several key advantages:

Advanced Design Features:

1. Thermal Stability: The black substrate boasts a dielectric constant of 2.65, maintaining consistent performance across broad temperature (-100°C to +150°C) and frequency ranges.
2. Enhanced Peel Strength: Superior adhesion between copper and the substrate compared to traditional ceramic vacuum film coatings, facilitating easier circuit processing, higher production pass rates, and significantly reduced manufacturing costs.
3. Low Dissipation Factor: With tgδ≤1*10^-3, minimal loss variations occur with increasing frequency, ensuring efficient signal transmission.
4. Mechanical Versatility: Ease of mechanical manufacturing processes such as drilling, punching, grinding, cutting, and etching, unmatched by ceramic substrates.
5. Weight Advantage: The lower specific gravity contributes to lighter module weights, a distinctive feature not achievable with other materials.

Technical Specifications at a Glance

• Appearance: Smooth and neat on both sides, free from stains, scratches, or dents.
• Dimensions & Tolerance: Offered in standard sizes (per esempio., 160160±2mm, 200200±2mm) with custom dimensions available upon request.
• Thickness Options: Range from 2.5mm to 12.0mm, catering to diverse application needs.
• Mechanical Properties: Impressive peel strength (≥6N/cm under normal conditions) and resilience in varying environmental conditions.
• Chemical Compatibility: Suitable for PCB chemical etching methods without altering material properties.
• Electrical Characteristics: Exhibits low moisture absorption (≤0.02%), wide operating temperature range (-100°C to +150°C), and excellent thermal conductivity (0.3 W/m/K).

Electrical Performance Highlights

• Density: Normal state at 1.05 g/cm³.
• Operating Temperature Range: -100°C to +150°C.
• Thermal Conductivity: 0.3 W/m/K across -55°C to +288°C.
• Coefficiente di dilatazione termica (CTE): 50 ppm/°C (x, y, z directions) from 0°C to 100°C.
• Shrinkage Factor: Minimal at 0.0004% after 2 hours in boiling water.
• Surface & Volume Resistivity: Exceptionally high, ensuring reliable insulation.
• Pin Resistance & Dielectric Breakdown: Robust performance under high voltage stress.
• Costante dielettrica & Fattore di dissipazione: Consistent at 2.65(±2%) and ≤1*10^-3 respectively at 10GHz.

The Rise of RF and Microwave Circuit Applications

As the demand for high-frequency applications surpassing 100 MHz and microwave circuits above 2 GHz grows, the need for specialized materials like TPH-1/2 becomes paramount. These advanced circuits find applications in remote controls, security systems, smartphones, sensori, and more, leveraging the unique properties of RF laminates for optimal performance.

Why Choose TPH-1/2 for Your Next Project?

Selecting the right material is crucial for the success of any RF PCB project. TPH-1/2 not only meets but exceeds industry standards with its:

• Risposta rapida & Service: 24/7 online support and no minimum order requirements.
• Versatile Capabilities & Fast Turnaround: Catering to urgent project needs efficiently.

For those seeking top-tier microwave radio frequency PCBs, explore our Microwave Circuit solutions tailored to your specific requirements.