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F4BK-1/2 Teflon Woven Glass Fabric Copper-Clad Laminates
F4BK-1/2 Teflon woven glass fabric copper-clad laminates is a composite of glass cloth, polytetrafluoroethylene resin and polytetrafluoroethylene, laminated in accordance with scientific formula and strict technological process. This product has certain advantages over the F4B series in terms of electrical performance (a wider range of dielectric constant).
Specifiche tecniche
Aspetto
Meet the specification requirements for the laminate of microwave PCB by National and Military Standards.
Tipi
- F4BK225
- F4BK265
Costante dielettrica
- 2.25
- 2.65
Dimension(mm)
- 300*250
- 380*350
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 1200*1000
- 1500*1000 For special dimension, customized laminates are available.
Spessore e tolleranza(mm)
| Spessore laminato | Tolleranza |
|---|---|
| 0.25 | ± 0,025 |
| 0.5 | ± 0,05 |
| 0.8 | ± 0,05 |
| 1.0 | ± 0,05 |
| 1.5 | ± 0,05 |
| 2.0 | ±0.075 |
| 3.0 | ± 0,09 |
| 4.0 | ±0.10 |
| 5.0 | ±0.10 |
Lo spessore del laminato include lo spessore del rame. For special dimensions, customized laminates are available.
Resistenza meccanica
Warp
| Spessore(mm) | Warp massimo |
|---|---|
| Original board | Single side |
| 0.25～ 0,5 | 0.030 |
| 0.8～ 1.0 | 0.025 |
| 1.5～ 2.0 | 0.020 |
| 3.0～ 5.0 | 0.015 |
Forza di taglio/punzonatura
| Thickness1mm | No Burrs After Cutting | Minimum Space Between Two Punching Holes | No Delamination |
|---|---|---|---|
| 0.55mm | |||
| >1mm | 1.10mm |
Forza della pelatura (1once di rame)
- Stato normale: ≥12N/cm; Nessuna bolle o delaminazione. Peel strength ≥10N/cm (in constant humidity and temperature, and kept in melting solder at 260°C±2°C for 20 secondi).
Chemical Property
According to the properties of the laminate, the chemical etching method for PCB can be used. The dielectric properties of the laminate are not changed. The plating through hole can be done but the sodium treatment or the plasma treatment must be used.
Electrical Property
| Nome | Condizione di prova | Unità | Valore |
|---|---|---|---|
| Densità | Stato normale | g/cm³ | 2.2～ 2.3 |
| Assorbimento di umidità | Immergere in acqua distillata 20 ± 2 ° C per 24 ore | % | ≤0.1 |
| Temperatura operativa | Camera di temperatura ad alta bassa | ° C. | -50°C～+250°C |
| Conducibilità termica | W/m/k | 0.3 | |
| Cte (tipico) | ppm/° C. | ||
| εr :2.1~2.3 | 25(X), 34(y), 240(z) | ||
| εr :2.3~2.9 | 16(X), 21(y), 186(z) | ||
| Fattore di restringimento | 2 ore in acqua bollente | % | ≤0.0002 |
| Resistività superficiale | M; | ||
| Stato normale | ≥3*10^4 | ||
| Umidità e temperatura costanti | ≥8*10^3 | ||
| Resistività al volume | Mω · cm | ||
| Stato normale | ≥2*10^6 | ||
| Umidità e temperatura costanti | ≥2*10^5 | ||
| Resistenza dielettrica superficiale | d = 1mm(Kv/mm) | ||
| Stato normale | ≥1.2 | ||
| Umidità e temperatura costanti | ≥1.1 | ||
| Costante dielettrica | |||
| 10GHz | εr | ||
| 2.25,2.65 | |||
| Fattore di dissipazione | Tgside | ||
| ≤1.5*10^-3 |
This structured format ensures that each section is clearly defined and logically organized, making it easier to understand the key points and specifications of the F4BK-1/2 Teflon woven glass fabric copper-clad laminates.
