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F4BME-2-A Teflon PCB Glass Fabric Copper-Clad Laminates
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, Teflon PCB resin, and filler with a Nano-ceramic membrane. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
Specifiche tecniche
Aspetto: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
Tipi:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
Dimensions (mm):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Le dimensioni personalizzate sono disponibili su richiesta.
Spessore e tolleranza (mm):
| Spessore laminato | Tolleranza |
|---|---|
| 0.254 | ± 0,025 |
| 0.508 | ± 0,05 |
| 0.762 | ± 0,05 |
| 0.787 | ± 0,05 |
| 1.016 | ± 0,05 |
| 1.27 | ± 0,05 |
| 1.524 | ± 0,05 |
| 2.0 | ±0.075 |
| 3.0 | ± 0,09 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Resistenza meccanica:
- Cutting/Punching:
- Spessore <1mm: Nessun bara dopo il taglio; minimum space between two punching holes is 0.55mm, Nessuna delaminazione.
- Spessore >1mm: Nessun bara dopo il taglio; minimum space between two punching holes is 1.10mm, Nessuna delaminazione.
- Forza della pelatura (1once di rame):
- Stato normale: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 secondi).
Chemical Property: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
Electrical Property:
| Nome | Condizione di prova | Unità | Valore |
|---|---|---|---|
| Densità | Stato normale | g/cm³ | 2.1～2.35 |
| Assorbimento di umidità | Dip in distilled water at 20±2°C for 24 ore | % | ≤0.07 |
| Temperatura operativa | Camera di temperatura ad alta bassa | ° C. | -50°C～+260°C |
| Conducibilità termica | W/m/k | 0.45~0.55 | |
| Cte (tipico) | -55～288°C (εr :2.5~2.9) | ppm/° C. | X: 16, Y: 20, Z: 170 |
| Cte (tipico) | -55～288°C (εr :2.9~3.0) | ppm/° C. | X: 12 Y: 15 Z: 90 |
| Fattore di restringimento | 2 ore in acqua bollente | % | <0.0002 |
| Resistività superficiale | DC, 500V, Stato normale | Mω | ≥4*10^5 |
| Resistività al volume | Stato normale | Mω · cm | ≥6*10^6 |
| Surface dielectric strength | d = 1mm(Kv/mm) | ≥1.2 | |
| Costante dielettrica | 10GHz | See table below | |
| Fattore di dissipazione | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL Flammability Rating: 94 V-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB Products:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, Rigid-Flex, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, and more.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.
