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プリント基板技術 - Page 3 of 37 - そして - Page 3

プリント基板技術

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プリント基板技術

This section tracks and reports the latest technological developments in the PCB industry for you, allowing you to understand the direction of technological development in the industry without leaving home. It popularizes knowledge about the PCB industry.

Why do PCB plated-through drillings require a copper pad?

2024-10-10 電子レンジの技術

The PCB dimension of the drillings specified by the designer represent the final dimension from a manufacturers point of view. Due to the through-plating, the PCB surface finish and the copper build-up in particular, the drilling diameter has to be ca ...

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What is the amplification principle of operational amplifier?

2024-10-10 電子設計

The operational amplifier has two input terminals and one output terminal. The input terminal marked with "" is "in-phase input terminal" rather than positive terminal), and the other input terminal marked with "1" is "inverse input terminal", which c ...

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Basic understanding of operational amplifier

2024-10-10 電子設計

In order to better learn about operational amplifiers, the following 16 questions and answers can quickly familiarize yourself with the basics of operational amplifiers. 1. 一般的に, there will be a balance resistance in the inverting / in-phase ...

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PCB 線幅と PCB 電流を制御する方法

2024-10-10 電子設計

This article discusses the importance of controlling PCB line width and current in electromechanical control systems, especially when dealing with high currents. It explains the empirical value of 10A/mm2 for wire cross-sectional area and the energy f ...

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MEMSマイクのパッケージング

2024-10-09 IC基板

MEMS(Micro Electromechanical System) microphone is a microphone based on MEMS IC substrate technology. Simply put, a capacitor is integrated on a micro silicon chip, which is mounted on a IC substrate with a suitable ASIC by means of surface-attaching ...

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ウェーハレベルパッケージング技術の紹介

2024-10-09 IC基板

The technique of cutting individual units from wafers and then packaging them has long been the norm for packaging semiconductor integrated circuits for decades. しかし, this approach is not currently being adopted by major semiconductor manufacturer ...

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SRAM- ウェーハレベルのパッケージングの要件 & チップ

2024-10-09 IC基板

IC PCB & Packaging- When talking about the future of wearable technology, the future course of wearable technology innovation is clear. It’s loud and clear that to succeed, wearable electronics must be small and still perform. This article focuses on ...

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光モジュール基板の設計と種類について

2024-10-07 プリント基板技術

Photonic modules play a pivotal role in high-speed communications due to their photoelectric signal conversion. The design of the PCB mainboard for photonic modules must meet special requirements such as high-speed transmission, 熱放散, プリント基板 ...

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ICパッケージ基板の主な材質は何ですか

2024-09-30 IC基板

パッケージ基板はICパッケージの最大のコストです,ICパッケージングコストにはパッケージング基板も含まれる,梱包材,機器の減価償却とテスト, among which the cost of IC substrate boards accounted fo ...

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ケイデンスのPCB設計

2024-09-30 電子設計

Cadence PCB design is a large EDA software that can complete almost all aspects of electronic design, including ASIC design,FPGA design, and PCB board design.

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RO4350B および FR4 は低コストの高周波 PCB を製造します

2024-09-29 電子レンジの技術

With the development of wireless communication technology, a variety of wireless signals carrying various kinds of information fill people's living spaces. Whether 2G (GSM), 3G (CDMA, WCDMA, TD-SCDMA), 4G (TDD/FDD LTE), WiFi and other wireless signals ...

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スネークルーティング: プリント基板設計における絶妙なダンスと電磁芸術

2024-09-23 プリント基板技術

On the miniaturized electronic stage of a PCB (プリント基板), every line and layout carries the exquisite choreography of electronic signals. In this precise dance, snake routing stands out with its unique form and significance, becoming the ...

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