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10-レイヤー3+N+3 HDI PCB - そして

HDI PCB/

10-レイヤー3+N+3 HDI PCB

名前: 10-layer 3-stage HDI PCB

レイヤー: 3+N+3

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 126*118mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.25mm

Line width and spacing: 2.8/3.2ミル

  • 製品詳細

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90Ω & 100Ω Differential Impedance

アプリケーション

家電

  • Cell Phones
  • タブレット
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

High-Density Interconnect (HDI) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • 医療機器
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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