10-layer PCB circuit board

Applications Overview

• Preamplifiers
• Satellite Antennas
• GPS Tracking Devices
• SAN Storage
• AC Drives
• GSM Signal Boosters
• Mobile Broadband Routers
• 220V Inverters
• Memory Modules
• Car Dashboards

10-Layer Manufacturing Process

材料の準備

• Cut material to size/bake material

Drilling and Inner Layer Patterning

• Inner layer drilling
• Inner layer pattern transfer
• Inner layer circuit inspection
• Etch/stripping
• Etch inspection

Surface Preparation and Laminating

• Browning
• Prepreg preparation
• Layers Pressing
• Cutting copper foil
• Positioning
• ラミネート加工

Drilling and Hole Preparation

• Target hole
• 掘削
• Desmear removal
• Immersion copper

Circuit Formation

• Image and text transfer
• Circuit inspection
• Copper and tin plating
• Film removal Etching
• Tin removal
• Etching inspection

Quality Control Tests

• Dielectric inspection test
• Solder mask inspection

Final Assembly and Finishing

• Text
• Baking pan
• Spray tin, イマージョンゴールド, Immersion tin
• Shape
• V cut

Final Product Inspection and Packaging

• Finished Product Test
• Antioxidant
• 最終検査
• Finished Product Extraction
• 包装