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Introduction to 10L Blind & Buried Hole PCB
The 10L Blind & Buried Hole PCB is a high-density interconnect (HDI) printed circuit board designed for complex electronic applications. This PCB features blind and buried hole technologies, which allow for intricate internal connections without compromising surface real estate. It is suitable for demanding applications requiring advanced functionality and reliability.
Purpose and Applications
Digital PCB
Primarily used in digital circuits, the 10L Blind & Buried Hole PCB ensures reliable connectivity and data transmission in critical electronic setups. Its robust design makes it ideal for applications requiring high signal integrity and durability.
Classification and Materials
FR4 Material
Constructed from FR4, this PCB offers excellent thermal stability and mechanical strength. The 1OZ copper thickness enhances conductivity and heat dissipation, making it suitable for high-performance applications.
Performance and Specifications
Layer Structure and Special Processes
The PCB consists of 10 layers with a unique layer structure: [specific layer structure details if provided]. It incorporates blind and buried holes, which allow for complex internal connections without compromising the board’s surface real estate. The minimum hole size is 0.2mm (8ミル), accommodating fine-pitch components.
Surface Treatment and Trace/Space
The surface treatment is immersion gold, providing good solderability and corrosion resistance. The trace/space configuration is 2.5mil/2.5mil, ensuring precise and dense circuitry layout.
製造工程
Steps Involved in Manufacturing
- 材料の準備: FR4 boards are cut to the required dimensions.
- Layer Stacking: The layers are stacked according to the specified structure.
- 掘削: Blind and buried holes are drilled with precision.
- メッキ: The holes are plated to create electrical connections between layers.
- エッチング: Unnecessary copper is removed to form the desired circuit pattern.
- 表面処理: The board undergoes immersion gold treatment for enhanced solderability.
- 検査: Each board is thoroughly inspected to ensure quality and compliance with specifications.
Key Features and Benefits
Advanced Technology Integration
The integration of blind and buried holes allows for more complex and compact designs, reducing the overall size of the PCB while maintaining high functionality.
High Reliability and Durability
The use of FR4 material ensures that the PCB can withstand high temperatures and harsh conditions, making it reliable for long-term use.
Enhanced Signal Integrity
The 1OZ copper thickness and precise trace/space configuration contribute to superior signal integrity, crucial for digital applications where data accuracy is paramount.
Use Cases and Scenarios
Digital Circuits
In digital circuits, the 10L Blind & Buried Hole PCB provides a stable platform for various electronic components, ensuring seamless operation and data protection.
Industrial Automation
For industrial automation, this PCB supports high-speed data transfer and robust connectivity essential for controlling machinery and monitoring processes efficiently.
Aerospace and Defense
In aerospace and defense applications, the PCB’s high thermal stability and reliability make it suitable for mission-critical equipment and systems.
結論
The 10L Blind & Buried Hole PCB stands out as a high-performance solution for complex electronic applications, especially in digital circuits. Its advanced features, robust materials, and precise manufacturing process ensure reliability and efficiency in demanding environments.
