12-layer automotive high-speed backplane design

Size and Space Savings

• Small size provides significant space savings.

Modularity and Flexibility

• Modular design provides application flexibility.

High Performance

• High performance system.

High-Density Backplane System

• High-density backplane system – まで 84 differential pairs per linear inch.

Post Spacing

• 1.80 mm post spacing.

Design Configurations

• 3 Pair, 4 Pair, そして 6 Pair Designs.
• 4, 6, または 8 columns.
• 12 – 48 pairs.

Signal/Ground Pin Options

• Multiple signal/ground pin classification options.

Integrated Components

• Provides integrated power, boot, keying, and sidewalls.

Impedance Options

• 85 Ω and 100 Ω options.

Hot Swap Capability

• Three-level sorting supports hot swap.

Cost-Effectiveness

• Cost-effective design for low-speed applications.