4L 1+N+1 HDI Wifi Module

Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview

The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.

Definition

A High-Density Interconnect (HDI) module refers to a printed circuit board (プリント基板) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.

Design Requirements

The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:

レイヤー: Four layers with a specific stack-up of 1+N+1.
材料: Made from high-quality FR-4 material.
厚さ: The overall finished thickness of the module is 1.0mm.
銅の厚さ: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
表面処理: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
最小トレース/スペース: Supports minimal trace and space widths of 4mil.
ミンホール: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.

Working Principle

The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.

アプリケーション

This versatile module is suitable for a wide range of applications including but not limited to:

家電: スマートフォン, 錠剤, smart home devices.
産業機器: Automation systems, control panels.
Communication Devices: ルーター, access points, set-top boxes.

分類

The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.

材料構成

Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.

性能特性

Signal Integrity: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
Thermal Management: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
Durability: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.

Structural Features

Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
Layer Stack-Up: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.

製造工程

The manufacturing process involves several key steps:

材料の準備: Cutting and preparing the FR-4 substrate.
銅ラミネート: Applying copper layers on both sides and inner layers as per design.
エッチング: Removing excess copper to form the desired circuit patterns.
Layer Alignment: Stacking and aligning the layers accurately.
Bonding: Using heat and pressure to bond the layers together.
表面処理: Applying immersion gold and OSP finishes.
品質管理: Conducting thorough inspections and tests to ensure product quality.

Use Case Scenarios

家電

In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.

産業機器

For automation systems, the module provides dependable communication links in harsh industrial environments.

Communication Devices

In routers and access points, the module enhances network performance with its superior signal handling capabilities.

By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.