5G communication circuit board design

Structure and Composition

Base Plate and Layers

The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top. The second layer of the solder resist ink layer is also present.

Substrate Divisions

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, and the inlay in the high-frequency area should be located at a fixed position.

Utility Model and Design

Division of Splint

The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.

High-Frequency Area Arrangement

The high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signals.

Product Specifications

Classification and Layers

• High Frequency Hybrid Product Classification Layers: 6 レイヤー

Board Material and Thickness

• Used Board: ロ4350b + FR4
• 厚さ: 1.6mm

Size and Surface Treatment

• Size: 210mm*280mm
• 表面処理: Gold-plated

Minimum Aperture and Application

• Minimum Aperture: 0.25mm
• 応用: コミュニケーション

特徴

• High Frequency Mixed Pressure