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6-layer Rogers + FR4 Hybrid Stacked PCB - そして

ハイブリッド基板/

6-layer Rogers + FR4 Hybrid Stacked PCB

製品名: 6-layer Rogers + FR4 Hybrid Stacked PCB

レイヤー: 6L

基板: ロジャース + FR4

銅の厚さ: 1オンス

Plate thickness: 2.3mm

Solder mask color: 緑 (can be customized)

Silk screen color: 白 (can be customized)

表面処理: イマージョンゴールド

Application industry: コミュニケーション

Application product: パワーアンプ

Outer line width/spacing: 7/7ミル

  • 製品詳細

概要

This printed circuit board (プリント基板) is a custom 6-layer Rogers + FR4 hybrid stacked PCB circuit board fabrication designed for communication applications, such as power amplifiers. The PCB circuit board features an immersion gold finish, which serves as the coating between the components and the bare PCB circuit board.

ロジャース + FR4 Hybrid Construction

The PCB is constructed using a combination of Rogers and FR4 materials. Rogers materials are known for their high-frequency performance and stability, while FR4 materials are cost-effective and widely used in the electronics industry. The hybrid construction allows for the optimization of both performance and cost.

Immersion Gold Finish

The immersion gold finish provides a protective coating between the components and the bare PCB circuit board. This coating enhances the reliability and durability of the PCB, as it prevents corrosion and improves electrical conductivity.

アプリケーション

The custom 6-layer Rogers + FR4 hybrid stacked PCB is ideal for communication applications, particularly those requiring high-frequency performance and stability. Examples include power amplifiers, which require precise control over impedance and signal integrity.

結論

In conclusion, the custom 6-layer Rogers + FR4 hybrid stacked PCB is a versatile and high-performance solution for communication applications. With its immersion gold finish and hybrid construction, it offers enhanced reliability, 耐久性, and cost-effectiveness.

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