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8 レイヤー RF PCB Rogers RO4350B + FR4ハイブリッドボード - そして

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8 レイヤー RF PCB Rogers RO4350B + FR4ハイブリッドボード

モデル: RO4350B Ceramic Hybrid High Frequency PCB

材料: Rogers RO4350B+FR4 Mixing Press

層: 8L

D K : 3.48

仕上がり厚さ : 2.5MM

銅の厚さ : 1オズ

誘電体の厚さ : 0.338mm

熱伝導率 : 0.69w/m.k

可燃性 : 94V-0

表面処理: イマージョンゴールド

応用: Communication Instrument

  • 製品詳細

RO4350B Ceramic Hybrid High Frequency PCB Overview

The RO4350B Ceramic Hybrid High Frequency PCB is a cutting-edge printed circuit board designed for high-performance applications in the communication industry. Combining the robustness of Rogers RO4350B material with the versatility of FR4, this PCB offers exceptional electrical and thermal properties, making it ideal for high-frequency circuits.

材料構成

The RO4350B Ceramic Hybrid High Frequency PCB is crafted from a unique blend of Rogers RO4350B and FR4 materials, pressed together to create a robust and reliable substrate. This mix ensures a balance of electrical performance and cost-effectiveness, making it suitable for a wide range of applications.

性能特性

  • レイヤー数: The PCB features an 8-layer design, providing ample space for complex circuitry and components.
  • 誘電率 (D K): With a D K of 3.48, the board exhibits stable electrical performance across a wide frequency range.
  • 仕上がり厚さ: The PCB has a finished thickness of 2.5mm, ensuring durability and structural integrity.
  • 銅の厚さ: The 1oz copper thickness offers excellent conductivity and current carrying capacity.
  • 誘電体の厚さ: The dielectric layer is 0.338mm thick, contributing to the board’s overall electrical performance.
  • 熱伝導率: With a thermal conductivity of 0.69w/m.k, the PCB effectively manages heat dissipation, preventing overheating and component failure.
  • 可燃性: The board meets the 94V-0 flammability rating, ensuring safety in various environments.

製造工程

The production of RO4350B Ceramic Hybrid High Frequency PCBs involves several precision steps:

  1. 材料の準備: Rogers RO4350B and FR4 materials are carefully selected and prepared for mixing.
  2. Mixing and Pressing: The materials are blended and pressed together under controlled conditions to form a uniform substrate.
  3. Circuit Design and Layout: The desired circuit patterns are designed and laid out using advanced CAD software.
  4. Manufacturing: The PCB is manufactured through a series of processes including etching, 掘削, and copper plating.
  5. 表面処理: The board undergoes immersion gold surface treatment to enhance conductivity and corrosion resistance.
  6. 品質管理: Each PCB undergoes rigorous testing to ensure it meets the specified performance standards.

アプリケーションシナリオ

The RO4350B Ceramic Hybrid High Frequency PCB is ideal for use in communication instruments, 含む:

  • High-Frequency Circuits: The PCB’s exceptional electrical properties make it suitable for high-frequency circuits in radio and microwave systems.
  • Antenna Arrays: Its robust design and stable performance support the operation of complex antenna arrays in communication networks.
  • Signal Processing Units: The PCB’s ability to handle high-speed signals ensures reliable performance in signal processing units.

要約すれば, the RO4350B Ceramic Hybrid High Frequency PCB is a versatile and high-performance solution for communication instruments, offering a combination of electrical excellence, thermal management, そして耐久性.

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