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Introduction to the Anylayer HDI 10Layers PCB Board
The Anylayer HDI 10Layers PCB board is a sophisticated high-density interconnect (HDI) プリント基板 (プリント基板) designed for advanced communication products. This guide will cover its definition, design requirements, working principles, applications, 分類, 材料, パフォーマンス, 構造, 特徴, 製造工程, and typical use cases.
Definition and Design Requirements
モデル: Anylayer HDI 10Layers PCB Board
This model refers to a ten-layer PCB featuring anylayer HDI technology, allowing for complex internal layer connections.
材料: IT180A
The base material used is IT180A, known for its excellent thermal stability, 機械的強度, and flame resistance.
Layer Composition: 10 Layers Anylayer
This indicates a ten-layer structure with flexible internal layer connectivity, optimizing signal integrity and power distribution.
仕上がり厚さ: 1.6mm
The total thickness of the finished PCB is 1.6 millimeters, ensuring durability while maintaining flexibility for various applications.
銅の厚さ: Inner 1OZ, Outer 0.5OZ
The copper traces on inner layers have a thickness of 1 ounce (オンス), whereas the outer layers feature a thinner 0.5 oz copper, balancing conductivity and space efficiency.
Working Principle and Purpose
表面処理: イマージョンゴールド + OSP
To enhance solderability and protect against oxidation, the PCB undergoes immersion gold plating on critical areas and organic solderability preservatives (OSP) on others.
最小トレース/スペース: 2.5ミル/2.5ミル
The PCB supports fine pitch components with a minimum trace width and spacing of 2.5 mils (thousandths of an inch), facilitating compact designs without compromising performance.
Min Hole Diameter: Mechanical Hole 0.2mm, Laser Hole 0.1mm
It accommodates small components through mechanical drilling down to 0.2mm and even finer laser-drilled holes at 0.1mm, enabling high-density integration.
応用: Communication Products PCB
Primarily tailored for communication products, this PCB ensures reliable signal transmission and minimal interference, crucial for maintaining clear and consistent data flow in telecommunication devices.
Classification and Materials
分類: High-Density Interconnect (HDI) プリント基板
HDI PCBとして, it belongs to a category of boards specifically engineered for complex electronic devices that require intricate routing and component placement.
材料: IT180A
IT180A is a composite material widely used in PCB manufacturing due to its balance of electrical properties, thermal resistance, and cost-effectiveness.
Performance and Structure
パフォーマンス: Superior Signal Integrity
With its carefully designed layer stack and use of high-quality materials, the Anylayer HDI 10Layers PCB guarantees exceptional signal integrity, reducing crosstalk and electromagnetic interference (EMI).
構造: Multi-Layer Arrangement
The structure comprises multiple layers strategically arranged to separate power planes from signal layers, minimizing noise and enhancing overall circuit performance. The inclusion of HDI technology allows for more intricate designs within a compact form factor.
Features and Production Process
Special Features: Advanced Anylayer HDI Technology
Designed with anylayer HDI technology, this PCB offers unparalleled flexibility in internal layer connectivity, enhancing design complexity and functionality.
製造工程: Precision Manufacturing
Manufacturing begins with material selection and continues through precision drilling, plating, and laminating processes. Each step is meticulously controlled to ensure adherence to tight tolerances and high standards of quality.
Typical Use Cases and Scenarios
Typical Use Cases: Telecommunication Equipment
Commonly employed in telecommunication equipment such as routers, スイッチ, and base stations where high-speed data transmission and reliability are essential.
Usage Scenarios: High-Frequency Applications
Suitable for high-frequency applications involving wireless communication modules, including those used in modern telecommunication devices.
In conclusion, the Anylayer HDI 10Layers PCB board stands out as a sophisticated solution for demanding communication product requirements, offering unparalleled density, パフォーマンス, and reliability tailored to modern telecommunication needs.
