UGPCBのロゴ
Structure and Composition
Base Plate and Layers
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of the solder resist ink layer is also present.
Substrate Divisions
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position.
Utility Model and Design
High-Frequency Area and Auxiliary Area
The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.
Material Usage
The high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized, and the production cost is reduced.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 レイヤー
Board Material and Thickness
- Used Board: ロ4350b + FR4
- 厚さ: 1.6mm
Size and Surface Treatment
- Size: 210mm*280mm
- 表面処理: Gold-plated
Minimum Aperture and Application
- Minimum Aperture: 0.25mm
- 応用: コミュニケーション
特徴
- High Frequency Mixed Pressure
