High-speed and high-density PCBA design 名前: High-speed and high-density PCBA design 皿: TG170 /TG180, F4BM, FR4, FR1-4, 等. Designable layers: 1-32 レイヤー Minimum line width and line spacing: 3ミル Minimum laser aperture: 4ミル Minimum mechanical aperture: 8ミル 銅箔の厚さ: 18-175цm (標準: 18цm35цm70цm) Peel strength: 1.25N/mm Minimum punching hole diameter: single side: 0.9mm/35mil Minimum hole diameter: 0.25mm/10mil Aperture tolerance: ≤φ0.8mm±0.05mm お問い合わせを送信 すぐに見積もりを取得 製品詳細 Definition of High-Speed PCB Design 要するに, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board. Key Physical Properties Layout 包装 レイヤースタッキング Interconnects 前へ: 14-layer 25G high-speed HDI PCB design 次: 12-layer automotive high-speed backplane design 関連製品 24-layer high-density high-speed PCB 12-layer automotive high-speed backplane design 14-layer 25G high-speed HDI PCB design High Speed Server Backplane PCB Design Communication terminal circuit board design 5G communication circuit board design Artificial intelligence circuit board design 高周波高速PCB設計 人気の製品 12L3+N+3 HDIボード Rogers RO3010 ウェーブガイドレーダーレベルゲージ用 テフロン高周波基板 レーダー基板 医療機器制御用PCBA 車の充電用PCBA