High-speed and high-density PCBA design 名前: High-speed and high-density PCBA design Plate: TG170 /TG180, F4BM, FR4, FR1-4, 等. Designable layers: 1-32 レイヤー Minimum line width and line spacing: 3ミル Minimum laser aperture: 4ミル Minimum mechanical aperture: 8ミル Copper foil thickness: 18-175цm (標準: 18цm35цm70цm) Peel strength: 1.25N/mm Minimum punching hole diameter: single side: 0.9mm/35mil Minimum hole diameter: 0.25mm/10mil Aperture tolerance: ≤φ0.8mm±0.05mm お問い合わせを送信 すぐに見積もりを取得 製品詳細 Definition of High-Speed PCB Design 要するに, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board. Key Physical Properties Layout 包装 Layer Stacking Interconnects 前へ: 14-layer 25G high-speed HDI PCB design 次: 12-layer automotive high-speed backplane design 関連製品 24-layer high-density high-speed PCB 12-layer automotive high-speed backplane design 14-layer 25G high-speed HDI PCB design High Speed Server Backplane PCB Design Communication terminal circuit board design 5G communication circuit board design Artificial intelligence circuit board design High Frequency High Speed PCB Design 人気の製品 12L3+N+3 HDIボード Rogers RO3010 ウェーブガイドレーダーレベルゲージ用 医療機器制御用PCBA テフロン高周波基板 車の充電用PCBA レーダー基板