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ISOLA 370HR 基板 - そして

高周波プリント基板/

ISOLA 370HR 基板

名前: ISOLA 370HR 基板

材料: isola 370hr HIGH TG PCB

Df (dissipation factor): 0.021

DK (誘電率): 4.04

Glass transition temperature: TG180℃

温度: 340℃

Number of layers: 6 レイヤー

板厚: 1.0mm

表面技術: immersion gold

銅の厚さ: 1オズ

Minimum line width/line spacing: 4ミル/4ミル

  • 製品詳細

Made with a patented, high performance 180°C Tg FR-4 multifunctional epoxy system, UGPCB Design’s 370HR laminates and prepregs are designed for multi-layer printed wiring board (プリント基板) applications that require the highest thermal performance and reliability. We manufacture 370HR laminates and prepregs using premium alkali-free glass fabric with excellent Conductive Anodic Filament (CAF) resistance. 370HR offers excellent thermal performance with a low coefficient of thermal expansion (CTE) and mechanical, 化学薬品, and moisture resistance properties that equal or exceed those of conventional FR-4 materials.

370HR is used in thousands of PWB designs and has proven to be best-in-class in thermal reliability, CAF performance, ease of processing, and sequential lamination design performance.

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