そして,プリント基板, PCBA および PECVD のカスタマイズ, 試作・製造プロデューサー

ダウンロード | について | 接触 | サイトマップ

ロジャース RO4350B + FR4 混合誘電体 RF PCB - そして

ハイブリッド基板/

ロジャース RO4350B + FR4 混合誘電体 RF PCB

モデル: Rogres ro4350B Hybrid PCB

DK: 3.48

構造: 2Layers rogres ro4350B+2layers Fr4

層: 4Layers PCB

仕上がり厚さ: 1.0mm

誘電体の厚さ: 0.508mm

Material CoThickness: ½(18μm)HH/HH

Finished Co Thickness: 1/0.5/0.5/1(オズ)

表面処理: Immersion Glod

応用: Communication PCB

  • 製品詳細

概要

The RO4350B + IT180 Mix Laminate High Frequency PCB is a specialized electronic component designed for high-performance applications in the communication industry. Combining the robustness of traditional FR4 materials with the advanced properties of Rogres RO4350B, this 4-layer PCB offers exceptional electrical performance and reliability.

材料構成

The PCB is constructed using a unique blend of materials:

  • Core Material: Rogres RO4350B, a high-frequency, low-loss laminate with a dielectric constant (DK) of 3.48. This material is known for its stability and low moisture absorption, making it ideal for high-speed digital and microwave applications.
  • Support Layers: Two layers of FR4, a standard fiberglass-reinforced epoxy laminate, provide structural support and cost-effectiveness.

Layer Configuration

The PCB features a 4-layer configuration:

  • Total Thickness: 1.0mm
  • 誘電体の厚さ: 0.508mm for the RO4350B layers
  • 銅の厚さ: 1/0.5/0.5/1 ounce per square foot (オズ), ensuring optimal conductivity and current carrying capacity.

性能特性

The RO4350B + IT180 Mix Laminate High Frequency PCB offers several key performance benefits:

  • Low Loss: The RO4350B material minimizes signal loss, ensuring clear and accurate transmission over high frequencies.
  • Stable Dielectric Constant: The consistent DK of 3.48 across temperature and humidity changes maintains signal integrity.
  • High Reliability: The combination of RO4350B and FR4 provides a durable and reliable PCB suitable for demanding applications.

製造工程

The production of the RO4350B + IT180 Mix Laminate High Frequency PCB involves several precision steps:

  1. 材料の準備: RO4350B and FR4 materials are cut to size and prepared for lamination.
  2. ラミネート加工: The layers are bonded together under controlled conditions to ensure uniform thickness and adhesion.
  3. Copper Cladding: Copper foil is applied to the outer layers to form the conductive circuits.
  4. エッチング: Unwanted copper is removed to create the desired circuit patterns.
  5. メッキ: An immersion gold finish is applied to the copper surfaces for enhanced conductivity and corrosion resistance.
  6. Final Assembly: Components are mounted, and the PCB is tested to ensure it meets specifications.

アプリケーションシナリオ

The RO4350B + IT180 Mix Laminate High Frequency PCB is ideal for a range of communication applications, 含む:

  • Wireless Communication Systems: Base stations, antennas, and other components requiring high-frequency signal transmission.
  • Radar Systems: High-precision radar equipment that relies on low-loss materials for accurate signal detection and processing.
  • Satellite Communications: Equipment that operates in extreme environments and requires reliable, high-speed data transmission.

結論

The RO4350B + IT180 Mix Laminate High Frequency PCB is a versatile and high-performance component suitable for demanding communication applications. Its combination of advanced materials and precision manufacturing ensures reliable performance and long-term durability.

前へ:

次:

返信を残す

伝言を残す