そして,プリント基板, PCBA および PECVD のカスタマイズ, 試作・製造プロデューサー

ダウンロード | について | 接触 | サイトマップ

片面PCB

モデル: Single-sided PCB

材料: CEM-1/CEM-3/FR-4/Al/PI

層: 1層

色: White/Black/Blue/Green

仕上がり厚さ: 0.6mm-1.6mm

銅の厚さ: 0.5OZ-2OZ

表面処理: OSP

最小トレース: 12ミル

最小スペース: 12ミル

  • 製品詳細

Single-sided PCB Overview

The Single-sided PCB is a fundamental component in electronic manufacturing, offering a simple yet effective platform for the assembly of electronic components. It features a single layer of conductive copper circuitry etched onto a non-conductive substrate, making it ideal for a range of applications where complexity is not a primary requirement.

材料構成

The Single-sided PCB is crafted from various materials to cater to different needs:

  • CEM-1: Combines paper and epoxy resin for cost-effectiveness and moderate durability.
  • CEM-3: Utilizes glass fiber and epoxy resin for enhanced mechanical strength and electrical insulation.
  • FR-4: Known for its flame retardant properties and high glass transition temperature, suitable for demanding applications.
  • アルミニウム (Al): Offers exceptional thermal conductivity, making it ideal for heat dissipation in high-power circuits.
  • ポリイミド (PI): Provides flexibility and durability, suitable for applications requiring bending or conformability.

性能特性

These boards are designed with specific performance attributes:

  • Layer Configuration: 1層, simplifying the design and manufacturing process.
  • カラーオプション: Available in white, 黒, blue, or green, allowing for aesthetic customization.
  • 厚さ: Finished thickness ranges from 0.6mm to 1.6mm, accommodating various component heights and packaging requirements.
  • 銅の厚さ: Copper thickness of 0.5OZ to 2OZ supports various current carrying capacities and circuit densities.

構造設計

構造的に, the Single-sided PCB comprises:

  • Base Material: The substrate that supports the copper circuitry.
  • 銅箔: Etched to form the circuit pattern.
  • Surface Finish: OSP (Organic Solderability Preservative) treatment ensures good solderability and protects the copper from oxidation.

特徴的な機能

Key features that distinguish Single-sided PCBs include:

  • 最小トレース/スペース: Minimum trace and space of 12mil enable high-density routing, crucial for compact designs.
  • 表面処理: OSP coating ensures reliable soldering and long-term circuit integrity.
  • 多用途性: Suitable for both prototype development and low-volume production runs.

Production Workflow

The production of Single-sided PCBs involves several stages:

  1. Design and Layout: Circuit diagrams are designed and laid out using CAD software.
  2. 材料の準備: The chosen substrate and copper foil are prepared.
  3. Circuit Etching: The copper foil is etched away to form the circuit pattern.
  4. 掘削: Holes are drilled for component mounting and interconnection.
  5. Surface Finish: OSP coating is applied to protect the copper.
  6. 品質管理: Boards undergo rigorous testing to ensure they meet specifications.
  7. Packaging and Shipment: Boards are packaged and shipped to customers.

アプリケーションシナリオ

Single-sided PCBs are widely used in:

  • Educational Kits: Simple circuits for teaching and learning electronics.
  • Prototyping: Early-stage development of electronic devices.
  • Low-Complexity Devices: Gadgets and appliances that do not require multi-layer complexity.
  • DIY Projects: Hobbyist and maker projects requiring cost-effective and straightforward PCBs.

By understanding the material composition, performance characteristics, structural design, distinctive features, production workflow, and application scenarios of Single-sided PCBs, one can appreciate their versatility and essential role in the electronics industry.

前へ:

次:

返信を残す

伝言を残す