UGPCBのロゴ
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UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.
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DS-7409 Variants
DS-7409
DS-7409S (N)
Material Properties of DS-7409
TG (ガラス転移温度)
Property: TG
ユニット: degree Celsius
Test Condition: DSC
代表値: 170
Test Method: IPC-TM-650.2.4.25c
TMA (Thermomechanical Analysis)
Property: TMA
ユニット: degree Celsius
Test Condition: N/A
代表値: 165
Test Method: IPC-TM-650.2.4.24c
CTE Z-axis (熱膨張係数)
Property: CTE Z-axis
ユニット: ppm/degree Celsius
Test Condition: Ambient to Tg
代表値: 41
Test Method: IPC-TM-650.2.4.41
Z-axis Expansion
Property: Z-axis Expansion
ユニット: %
Test Condition: 50 degree Celsius to 260 degree Celsius
代表値: 3.3
Test Method: IPC-TM-650.2.4.41
Decomposition Temperature (5% wt loss)
Property: Decomposition Temperature
ユニット: degree Celsius
Test Condition: TGA
代表値: 295
Test Method: IPC-TM-650.2.4.40
T-260 & T-288 (Thermomechanical Analysis)
Property: T-260
ユニット: 分
Test Condition: TMA
代表値: 7
Test Method: IPC-TM-650.2.4.24.1
Property: T-288
ユニット: 分
Test Condition: TMA
代表値: –
Test Method: IPC-TM-650.2.4.24.1
誘電率 & 損失係数
Property: 誘電率 (Resin content 50%)
ユニット: C-24/23/50(1GHz)
Test Condition: N/A
代表値: 4.2
Test Method: IPC-TM-650.2.5.5.9
Property: 損失係数 (Resin content 50%)
ユニット: C-24/23/50(1GHz)
Test Condition: N/A
代表値: 0.015
Test Method: IPC-TM-650.2.5.5.9
はく離強度
Property: はく離強度 (Standard profile 1oz)
ユニット: N/mm
Test Condition: Condition A
代表値: 2.0
Test Method: IPC-TM-650.2.4.8
吸水性
Property: 吸水性
ユニット: %
Test Condition: E-24/50+D-24/23
代表値: 0.12
Test Method: IPC-TM-650.2.6.2.1
