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F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates
F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.
Technical Specifications
Appearance
The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.
Types
- F4B255
- F4B265
誘電率
- 2.55
- 2.65
Available Dimensions (mm)
- 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
- 840×840, 1200×1000, 1500×1000
- Custom dimensions are available upon request.
銅の厚さ
- 0.035μm, 0.018μm
Thickness and Tolerance (mm)
| Laminate Thickness | Tolerance |
|---|---|
| 0.17, 0.25 | ±0.025 |
| 0.5, 0.8, 1.0 | ±0.05 |
| 1.5, 2.0 | ±0.05 |
| 3.0, 4.0, 5.0 | ±0.09 |
The laminate thickness includes the copper thickness. Custom dimensions are available upon request.
Mechanical Strength
| 厚さ (mm) | Maximum Warp | Single Side | Double Side |
|---|---|---|---|
| 0.25～0.5 | 0.030 | 0.050 | 0.025 |
| 0.8～1.0 | 0.025 | 0.030 | 0.020 |
| 1.5～2.0 | 0.020 | 0.025 | 0.015 |
| 3.0～5.0 | 0.015 | 0.020 | 0.010 |
Cutting/Punching Strength:
- Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, no delamination.
- 厚さ >1mm: No burrs after cutting, minimum space between punching holes is 1.10mm, no delamination.
はく離強度 (1oz copper)
- Normal State: ≥15N/cm; No bubbles or delamination.
- After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 秒).
Chemical Properties
These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.
電気的特性
| 名前 | Test Condition | ユニット | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.2～2.3 |
| Moisture Absorption | Dip in distilled water 20±2°C for 24 時間 | % | ≤0.1 |
| Operating Temperature | High-low temperature chamber | ℃ | -50～+260 |
| 熱伝導率 | W/m/k | 0.3 | |
| CTE (typical) | 0～100°C | ppm/°C | x:16, y:21 z:186 |
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| 表面抵抗率 | 500V DC, Normal state | M·Ω | ≥1*10⁴ |
| Constant humidity and temperature | ≥5*10³ | ||
| 体積抵抗率 | Normal state | MΩ.cm | ≥1*10⁶ |
| Constant humidity and temperature | ≥9*10⁴ | ||
| Pin Resistance | 500VDC, Normal state | MΩ | ≥5*10⁴ |
| Constant humidity and temperature | ≥5*102 | ||
| Surface Dielectric Strength | Normal state, d=1mm (Kv/mm) | ≥1.2 | |
| Constant humidity and temperature | ≥1.1 | ||
| 誘電率 | 10GHZ, | εr | 2.55/2.65 (±2%) |
| 損失係数 | 10GHZ, | tgδ | ≤1*10⁻³ |
