Doosan DS-7409 Hg (KQ) ICパッケージ基板材料

導入

UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.

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DS-7409 Variants

DS-7409
DS-7409S (N)

Material Properties of DS-7409

TG (ガラス転移温度)

Property: TG
ユニット: 学位摂氏
テスト条件: DSC
代表値: 170
Test Method: IPC-TM-650.2.4.25c

TMA (Thermomechanical Analysis)

Property: TMA
ユニット: 学位摂氏
テスト条件: N/A
代表値: 165
Test Method: IPC-TM-650.2.4.24c

CTE Z-axis (熱膨張係数)

Property: CTE Z-axis
ユニット: PPM/学位摂氏
テスト条件: Ambient to Tg
代表値: 41
Test Method: IPC-TM-650.2.4.41

Z-axis Expansion

Property: Z-axis Expansion
ユニット: %
テスト条件: 50 degree Celsius to 260 学位摂氏
代表値: 3.3
Test Method: IPC-TM-650.2.4.41

Decomposition Temperature (5% wt loss)

Property: Decomposition Temperature
ユニット: 学位摂氏
テスト条件: TGA
代表値: 295
Test Method: IPC-TM-650.2.4.40

T-260 & T-288 (Thermomechanical Analysis)

Property: T-260
ユニット: 分
テスト条件: TMA
代表値: 7
Test Method: IPC-TM-650.2.4.24.1

Property: T-288
ユニット: 分
テスト条件: TMA
代表値: –
Test Method: IPC-TM-650.2.4.24.1

誘電率 & 損失係数

Property: 誘電率 (Resin content 50%)
ユニット: C-24/23/50(1GHz)
テスト条件: N/A
代表値: 4.2
Test Method: IPC-TM-650.2.5.5.9

Property: 損失係数 (Resin content 50%)
ユニット: C-24/23/50(1GHz)
テスト条件: N/A
代表値: 0.015
Test Method: IPC-TM-650.2.5.5.9

はく離強度

Property: はく離強度 (Standard profile 1oz)
ユニット: N/mm
テスト条件: 条件a
代表値: 2.0
Test Method: IPC-TM-650.2.4.8

吸水性

Property: 吸水性
ユニット: %
テスト条件: E-24/50+D-24/23
代表値: 0.12
Test Method: IPC-TM-650.2.6.2.1