UGPCBのロゴ
Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, 良好なPCB加工性, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRAM, AP, PA, Dual CM, Fingerprint, and RF Module.
Specifications of SI10U
| Items | Conditions | ユニット | SI10U(S) |
|---|---|---|---|
| TG | DMA | 学位摂氏 | 280 |
| TD | 5% 重量. 損失 | 学位摂氏 | >400 |
| CTE (X/Y-axis) | Tg前 | PPM/学位摂氏 | 10 |
| CTE (z軸) | α1/α2 | PPM/学位摂氏 | 25/135 |
| 誘電率 (1GHz) | – | – | 2.5.5.9 |
| 損失係数 (1GHz) | – | – | 2.5.5.9 |
| はく離強度 | 1/3 オズ, VLP Cu | N/mm | 0.80 |
| Solder Dipping | @288 degree Celsius | 分 | >=30 |
| Young’s Modulus | 50 学位摂氏 | GPa | 26 |
| Young’s Modulus | 200 学位摂氏 | GPa | 23 |
| Flexural Modulus (50 学位摂氏) | GPa | 32 | |
| Flexural Modulus (200 学位摂氏) | GPa | 27 | |
| 吸水性 (あ) | % | 0.14 | |
| 吸水性 (85 degree Celsius/85%RH,168Hr) | % | 0.35 | |
| 可燃性 | UL-94 Rating | V-0 | |
| 熱伝導率 | W/(m.K) | 0.61 | |
| 色 | – | 黒 |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
