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Teflon Woven Glass Fabric Copper-Clad Laminates
Teflon woven glass fabric copper-clad laminates are formulated with varnished glass cloth, prepreg, and Teflon PCB resin through scientific formulation and strict technology procedures. These materials offer several advantages over the F4B series in terms of electrical performance, including a wider range of dielectric constants, low dielectric loss angle tangent, increased resistance, and more stable performance.
技術仕様
外観
The appearance meets the specification requirements for microwave PCB baseplates specified in National and Military Standards.
Types
- F4BM220
- F4BM255
- F4BM265
- F4BM300
- F4BM350
Permittivity
- 2.20
- 2.55
- 2.65
- 3.0
- 3.50
寸法 (mm)
- 300*250
- 350*380
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 840*1200
- 1500*1000
For special dimensions, customized lamination is available.
厚さと寛容 (mm)
| Plate Thickness | 許容範囲 |
|---|---|
| 0.25 | ±0.02～±0.04 |
| 0.5 | |
| 0.8 | |
| 1.0 | |
| 1.5 | ±0.05～±0.07 |
| 2.0 | |
| 3.0 | |
| 4.0 | |
| 5.0 |
Plate thickness includes the copper thickness. For special dimensions, customized lamination is available.
機械的性質
Angularity
| Plate Thickness(mm) | Maximum Angularity mm/mm |
|---|---|
| Original board | Single-sided board |
| 0.25～0.5 | 0.03 |
| 0.8～1.0 | 0.025 |
| 1.5～2.0 | 0.020 |
| 3.0～5.0 | 0.015 |
Cutting/ Punching Property
- For plates <1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.
- For plates ≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation.
はく離強度
- In normal state: ≥18N/cm; no bubbling, no separation, and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260 degree Celsius±2 degree Celsius for 20 秒.
化学的性質
According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.
電気的特性
| Names | Test Conditions | ユニット | 仕様 |
|---|---|---|---|
| Gravity | Normal state | g/cm3 | 2.2～2.3 |
| Water absorption rate | Dip in distilled water of 20±2 degree Celsius for 24 時間 | % | ≤0.02 |
| Operating temperature | High-low temperature chamber | 学位摂氏 | -50～+260 |
| Thermal conductivity coefficient | Kcal /m .h. 学位摂氏 | 0.8 | |
| Coefficient of thermal expansion | Temperature rise of 96 degree Celsius per hour | Coefficient of thermal expansion*1 | ≤5*10^-5 |
| Shrinkage factor | Two hours in boiling water | % | 0.0002 |
| Surface insulation resistance | 500V DC | Normal state | MΩ |
| Constant humidity and temperature | ≥1*10^3 | ||
| Volume resistance | Normal state | MΩ.cm | ≥1*10^6 |
| Constant humidity and temperature | ≥1*10^5 | ||
| Pin resistance | 500V DC | Normal state | MΩ |
| Constant humidity and temperature | ≥1*10^3 | ||
| Surface dielectric strength | Normal state | δ=1mm(kV/mm) | ≥1.2 |
| Constant humidity and temperature | ≥1.1 | ||
| Permittivity | 10GHZ | は | 2.20 |
| 2.55 | |||
| 2.65(±2%) | |||
| 3.0 | |||
| 3.5 | |||
| Dielectric loss angle tangent | 10GHZ | tgside | ≤7*10^-4 |
UGPCB has produced Teflon woven glass fabric copper-clad laminates products steadily. If you need them, UGPCBにお問い合わせください.
