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10-layer 1+N+1 HDI communication PCB - 그리고

HDI PCB/

10-layer 1+N+1 HDI communication PCB

이름: 10-layer 1-stage HDI communication PCB

레이어: 1+8+1

시트: FR4 Tg170

판 두께: 1.2mm

패널 크기: 110.8*94.8mm/4

외부 구리 두께: 35μm

내층 구리 두께: 18μm

최소 관통 구멍: 0.20mm

Minimum blind hole: 0.10mm

최소 BGA: 0.20mm

Line width and line spacing: 2.5/2.2밀

  • 제품 세부정보

Technical Features

Impedance Specifications

  • 50 Ω Antenna
  • 90오 & 100Ω Differential Impedance

응용

가전제품

  • Cell Phones
  • 정제
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

Other Applications

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile phones
  • Touch screen devices
  • Laptops
  • Digital cameras
  • 4G network communications

추가적으로, HDI PCB technology plays a crucial role in:

  • Medical equipment
  • Various electronic aircraft components

The possibilities for high-density interconnect PCB technology seem almost limitless, offering significant advantages in terms of size, 무게, and electrical performance across a wide range of applications.

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