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10-레이어 3+N+3 HDI PCB - 그리고

HDI PCB/

10-레이어 3+N+3 HDI PCB

이름: 10-layer 3-stage HDI PCB

레이어: 3+N+3

시트: FR4 Tg170

판 두께: 1.2mm

패널 크기: 126*118mm/4

외부 구리 두께: 35μm

내층 구리 두께: 18μm

최소 관통 구멍: 0.20mm

Minimum blind hole: 0.10mm

최소 BGA: 0.25mm

Line width and spacing: 2.8/3.2밀

  • 제품 세부정보

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90오 & 100Ω Differential Impedance

응용

가전제품

  • Cell Phones
  • 정제
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

고밀도 상호 연결 (HDI) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • 의료 장비
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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