그리고,PCB, PCBA 및 PECVD 맞춤화, 프로토타이핑 및 제조 생산자

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12L 3+N+3 HDI 보드 - 그리고

PCB 제품/HDI PCB/

12L 3+N+3 HDI 보드

층: 12 레이어
Minimum line width/spacing: 0.076mm/0.076mm
Minimum finished aperture: 0.1mm
표면 처리: Electroless Nickel Gold
재료: FR4TG170
응용 분야: industrial computer

  • 제품 세부정보

PCB is known asthe mother of electronic system products”. As the basic material of electronic products, PCB has a broad demand market. The downstream application fields include communication, 컴퓨터, 가전제품, industrial control and medical treatment, automobile electronics, 항공우주, 등., among which communication and computer are the largest application plates of PCB, accounting for more than 25%.

커뮤니케이션 분야에서는, PCB is widely used in wireless network, transmission network, data communication, fixed network broadband. Related PCB products include backplane PCB, 고속 PCB, 다층 PCB, 고주파 PCB, microwave PCB, multi-functional Metal Based PCB board, 등.

In 5g wireless base station, bearer network, transmission network, core network hardware facilities, the application of PCB hardware will be greatly increased. 동시에, 5g terminal equipment, such as mobile phones and smart watches, should also be updated with communication technology, and the demand for communication PCB board in this part should be increased.

Communication product

UGPCB has a complete set of communication circuit board production equipment to reduce the risk of outsourcing production.

UGPCB is specially equipped with plasma degumming machine and ultra long plate parallel exposure machine for communication industry, with exposure length up to 2m.

UGPCB specially introduces the rare surface treatment production line for communication industry: silver plating, tin plating, silver precipitation and tin deposition.

UGPCB has exquisite process ability to meet the demand of communication PCB.

UGPCB has mature mixing technology: FR4 + PTFE, FR4 + 408hr, FR4 + 로저스, 도예 + FR4.

UGPCB can produce 1.5mil/1.5mil line width, and the impedance tolerance can be controlled within ± 5%.

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